Concepedia

Kejun Zeng

KZ

24

Publications

1.6K

Citations

19

H-Index

1990

Active since

Affiliations

Texas Instruments (United States)(Current)

Central South University

VTT Technical Research Centre of Finland

Texas Instruments (Japan)

University of California, Los Angeles

Kejun Zeng is an author at Texas Instruments (United States) specializing in engineering, materials science, and materials engineering.

Top concepts

EngineeringMaterial ScienceMicrostructureMaterials EngineeringApplied PhysicsElectronic PackagingThermodynamicsSurface ScienceCorrosionPhysics

Publications per year

1990–2023

24

Publications

24

Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability

Kejun Zeng, R.J. Stierman, Tz-Cheng Chiu et al. · Journal of Applied Physics · 2004 · 435 citations

Engineering, Mechanical Engineering, Kirkendall Void Formation +16

Effect of thermal aging on board level drop reliability for Pb-free BGA packages

Tz-Cheng Chiu, Kejun Zeng, R.J. Stierman et al. · 2004 · 247 citations

Materials Science, Electrical Engineering, Reliability Engineering +15

Interfacial reactions between lead-free SnAgCu solder and Ni(P) surface finish on printed circuit boards

Kejun Zeng, Vesa Vuorinen, J.K. Kivilahti · IEEE Transactions on Electronics Packaging Manufacturing · 2002 · 121 citations

Interfacial Reactions, Engineering, Mechanical Engineering +20

Thermodynamic analysis of the hydriding process of Mg–Ni alloys

Kejun Zeng, Thomas Klassen, W. Oelerich et al. · Journal of Alloys and Compounds · 1999 · 91 citations

Materials Science, Thermodynamic Analysis, Engineering +4

Failure mechanism of Ta diffusion barrier between Cu and Si

Tomi Laurila, Kejun Zeng, J.K. Kivilahti et al. · Journal of Applied Physics · 2000 · 89 citations

Engineering, Chemical Deposition, Silicon On Insulator +16

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