Kejun Zeng - Concepedia

Author

Kejun Zeng

Texas Instruments (United States)

Also Known As

K. Zeng, Kejun Zeng, W.-S. Lin, Zeng Kejun, Zeng, Kai

Publications

1.7K

Citations

H-Index

Concepts

All Affiliations

Texas Instruments (United States)Central South University VTT Technical Research Centre of Finland Texas Instruments (Japan)University of California, Los Angeles

About

Kejun Zeng is an author at Texas Instruments (United States) specializing in engineering, materials science, and materials engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	18	22	1.6K
2	Applied Physics	8	8	422
3	Natural Sciences	3	3	131
4	Business	1	1	12
5	Chemical Engineering	1	1	27

Kejun Zeng

Publications

1.6K

Citations

H-Index

Page 1

	Year	Citations
Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability Kejun Zeng, R.J. Stierman, Tz-Cheng Chiu, Journal of Applied Physics EngineeringMechanical EngineeringKirkendall Void FormationBare CuAdvanced Packaging (Semiconductors)	2004	435
Effect of thermal aging on board level drop reliability for Pb-free BGA packages Tz-Cheng Chiu, Kejun Zeng, R.J. Stierman, Materials ScienceElectrical EngineeringReliability EngineeringEngineeringChip-scale Package	2004	247
Interfacial reactions between lead-free SnAgCu solder and Ni(P) surface finish on printed circuit boards Kejun Zeng, Vesa Vuorinen, J.K. Kivilahti IEEE Transactions on Electronics Packaging Manufacturing Interfacial ReactionsEngineeringMechanical EngineeringPrinted Circuit BoardsLead-free Snagcu Solder	2002	121
Thermodynamic analysis of the hydriding process of Mg–Ni alloys Kejun Zeng, Thomas Klassen, W. Oelerich, Journal of Alloys and Compounds Materials ScienceThermodynamic AnalysisEngineeringAlloy DesignThermodynamics	1999	91
Failure mechanism of Ta diffusion barrier between Cu and Si Tomi Laurila, Kejun Zeng, J.K. Kivilahti, Journal of Applied Physics EngineeringChemical DepositionSilicon On InsulatorTa Barrier LayerFailure Mechanism	2000	89
The root cause of black pad failure of solder joints with electroless Ni/Immersion gold plating Kejun Zeng, R.J. Stierman, D.C. Abbott, JOM Materials ScienceMaterials EngineeringEngineeringCorrosionRoot Cause	2006	81
Thermodynamic analysis of stable and metastable equilibria in the Cu-Cr system Kejun Zeng, Marko Hämäläinen Calphad Thermodynamic AnalysisEngineeringPhysicsPhase EquilibriumNatural Sciences	1995	60
Thermodynamics of the Ni–H system Kejun Zeng, Thomas Klassen, W. Oelerich, Journal of Alloys and Compounds EngineeringPhysicsEntropyNatural SciencesEquilibrium Thermodynamics	1999	50
Critical Assessment and Thermodynamic Modeling of the Ti-N System Kejun Zeng, Rainer Schmid‐Fetzer International Journal of Materials Research (formerly Zeitschrift fuer Metallkunde) EngineeringExperimental ThermodynamicsChemistryEngineering ThermodynamicsStructural Materials	1996	49
TaC as a diffusion barrier between Si and Cu Tomi Laurila, Kejun Zeng, J.K. Kivilahti, Journal of Applied Physics EngineeringSolid-state ChemistrySilicon On InsulatorElectron MicroscopyAdditional Barrier Layer	2002	47

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