Interfacial reactions between lead-free SnAgCu solder and Ni(P) surface finish on printed circuit boards

Abstract

Transmission electron microscopy and scanning electron microscopy were employed to analyze the interfacial microstructure between Sn-Ag-Cu solder alloys and Ni(P)/Au metallizations. The intermetallic compound Cu/sub 6/Sn/sub 5/, containing a small amount of dissolved Ni, was found to form preferentially on the Ni coating. This compound layer served as a barrier for direct reaction of Sn with the Ni(P) coating. On the Ni(P) side, a nickel phosphide was identified. Thermodynamic evaluation of the Cu-Ni-Sn system was carried out to rationalize the enrichment of Cu at the solder/finish interface. Effects of the interfacial reactions on joint reliability are discussed.