Concepedia

Joint Reliability

Joint Reliability is a performance metric in adhesive bonding that quantifies the probability of a bonded joint maintaining its structural integrity under specified loading and environmental conditions over time.

347

Publications

12.4K

Citations

1.1K

Authors

334

Institutions

Publications per year

2017–2026

69

Parents

Publications

347

Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability

Kejun Zeng, R.J. Stierman, Tz-Cheng Chiu et al. · Journal of Applied Physics · 2004 · 437 citations

, , +16

Effect of thermal aging on board level drop reliability for Pb-free BGA packages

Tz-Cheng Chiu, Kejun Zeng, R.J. Stierman et al. · 2004 · 248 citations

, , +17

Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability

Rabih Khazaka, L. Mendizabal, David Henry · Journal of Electronic Materials · 2014 · 189 citations

, , +16

Durability of bonded FRP-to-steel joints: Effects of moisture, de-icing salt solution, temperature and FRP type

Mohsen Heshmati, Reza Haghani, Mohammad Al‐Emrani · Composites Part B Engineering · 2017 · 187 citations · Full text

, , +15

Durability of steel/CFRP double strap joints exposed to sea water, cyclic temperature and humidity

Tien-Cuong Nguyen, Yu Bai, Xiao‐Ling Zhao et al. · Composite Structures · 2012 · 179 citations

, , +8

1–5 of 347

Authors

1.1K

  1. JH
    John H. Lau

    Industrial Technology Research Institute, Taiwan

    16 publications · 466 citations

    14

    h-index

  2. PL
    Pradeep Lall

    Auburn University, United States

    9 publications · 440 citations

    9

    h-index

  3. SJ
    Seung‐Boo Jung

    Sungkyunkwan University, South Korea

    9 publications · 329 citations

    9

    h-index

  4. GL
    Guo‐Quan Lu

    Virginia Tech, United States

    8 publications · 263 citations

    8

    h-index

  5. JY
    Jeong‐Won Yoon

    Sungkyunkwan University, South Korea

    7 publications · 281 citations

    7

    h-index

1–5 of 1.1K

Institutions

334

  1. Nanyang Technological University

    Singapore, Singapore

    11 h-index

    22 publications

    1.3K citations

  2. Sungkyunkwan University

    Seoul, South Korea

    10 h-index

    36 publications

    1.2K citations

  3. Hewlett-Packard (United States)

    Palo Alto, United States

    10 h-index

    38 publications

    945 citations

  4. Intel (United States)

    Santa Clara, United States

    9 h-index

    23 publications

    610 citations

  5. The University of Osaka

    Osaka, Japan

    9 h-index

    29 publications

    827 citations

  6. Auburn University

    Auburn, United States

    9 h-index

    49 publications

    2.6K citations

  7. Virginia Tech

    Blacksburg, United States

    8 h-index

    18 publications

    486 citations

  8. Korea Advanced Institute of Science and Technology

    Daejeon, South Korea

    7 h-index

    18 publications

    620 citations

1–8 of 334

Venues

  1. Microelectronics Reliability

    27 publications · 860 citations

    18

    h-index

  2. Soldering and Surface Mount Technology

    15 publications · 301 citations

    13

    h-index

  3. Journal of Electronic Materials

    JEM · 11 publications · 535 citations

    11

    h-index

  4. International Journal of Adhesion and Adhesives

    12 publications · 436 citations

    11

    h-index

  5. IEEE Transactions on Reliability

    8 publications · 451 citations

    8

    h-index

1–5