Guo‐Quan Lu

Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material

John G. Bai, Ziyang Zhang, Jesus N. Calata et al. · IEEE Transactions on Components and Packaging Technologies · 2006 · 370 citations

Engineering, Materials Engineering, Materials Science +17

Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection

Tao Wang, Xu Chen, Guo‐Quan Lu et al. · Journal of Electronic Materials · 2007 · 341 citations

Natural Sciences, Materials Engineering, Materials Science +13

Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips

Thomas G. Lei, Jesus N. Calata, Guo‐Quan Lu et al. · IEEE Transactions on Components and Packaging Technologies · 2009 · 236 citations

Engineering, Materials Engineering, Materials Science +17

Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow

Z. Zhang, Guo‐Quan Lu · IEEE Transactions on Electronics Packaging Manufacturing · 2002 · 216 citations

Natural Sciences, Materials Engineering, Materials Science +17

Thermomechanical Reliability of Low-Temperature Sintered Silver Die Attached SiC Power Device Assembly

John G. Bai, Guo‐Quan Lu · IEEE Transactions on Device and Materials Reliability · 2006 · 209 citations

Engineering, Materials Engineering, Materials Science +17