Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection

Effect of Change of Scale on Sintering Phenomena

Conyers Herring · Journal of Applied Physics · 1950 · 1K citations

Natural Sciences, Materials Engineering, Materials Science +13

Thermal behavior of silver nanoparticles for low-temperature interconnect applications

Kyoung‐sik Moon, Hai Dong, Radenka Marić et al. · Journal of Electronic Materials · 2005 · 380 citations

Engineering, Materials Engineering, Materials Science +16

Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow

Z. Zhang, Guo‐Quan Lu · IEEE Transactions on Electronics Packaging Manufacturing · 2002 · 216 citations

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Novel large area joining technique for improved power device performance

H. Schwarzbauer, R. Kuhnert · IEEE Transactions on Industry Applications · 1991 · 197 citations

Engineering, Materials Engineering, Materials Science +17

Three-dimensional morphology of a very rough interface formed in the soldering reaction between eutectic SnPb and Cu

H. K. Kim, H. K. Liou, K. N. Tu · Applied Physics Letters · 1995 · 193 citations

Natural Sciences, Materials Engineering, Materials Science +17