Concepedia

H. K. Kim

HK

7

Publications

601

Citations

7

H-Index

1995

Active since

Affiliations

University of California, Los Angeles(Current)

IBM (United States)

Semiconductor Manufacturing International (Italy)

Hodges University

H. K. Kim is an author at University of California, Los Angeles specializing in materials engineering, engineering, and materials science.

Top concepts

EngineeringMaterial ScienceMaterials EngineeringMicrostructureApplied PhysicsSurface ScienceElectronic PackagingNanotechnologyThin FilmsSolidification

Publications per year

1995–1997

7

Publications

7

Three-dimensional morphology of a very rough interface formed in the soldering reaction between eutectic SnPb and Cu

H. K. Kim, H. K. Liou, K. N. Tu · Applied Physics Letters · 1995 · 193 citations

Engineering, Rough Interface, Electron Microscopy +19

Spalling of Cu6Sn5 spheroids in the soldering reaction of eutectic SnPb on Cr/Cu/Au thin films

Ann A. Liu, H. K. Kim, K. N. Tu et al. · Journal of Applied Physics · 1996 · 131 citations

Engineering, Thin Film Process Technology, Chemical Deposition +17

Ripening-assisted asymmetric spalling of Cu-Sn compound spheroids in solder joints on Si wafers

H. K. Kim, K. N. Tu, P. A. Totta · Applied Physics Letters · 1996 · 102 citations

Engineering, Mechanical Engineering, Cu-sn Compound Spheroids +18

Morphology of instability of the wetting tips of eutectic SnBi, eutectic SnPb, and pure Sn on Cu

H. K. Kim, H. K. Liou, K. N. Tu · Journal of materials research/Pratt's guide to venture capital sources · 1995 · 62 citations

Materials Engineering, Materials Science, Engineering +6

Microstructures of phased-in Cr–Cu/Cu/Au bump-limiting metallization and its soldering behavior with high Pb content and eutectic PbSn solders

G. Z. Pan, Ann A. Liu, H. K. Kim et al. · Applied Physics Letters · 1997 · 50 citations

Materials Science, Materials Engineering, Eutectic Pbsn Solders +15

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