P. A. Totta

SLT Device Metallurgy and its Monolithic Extension

P. A. Totta, R.P. Sopher · IBM Journal of Research and Development · 1969 · 240 citations

Stress-Induced Phenomena In Metallization

Paul S. Ho, C.Y. Li, P. A. Totta · 1994 · 159 citations

Materials Science, Vlsi Fabrication Technology, Electromigration Technique +13

Spalling of Cu6Sn5 spheroids in the soldering reaction of eutectic SnPb on Cr/Cu/Au thin films

Ann A. Liu, H. K. Kim, K. N. Tu et al. · Journal of Applied Physics · 1996 · 131 citations

Engineering, Thin Film Process Technology, Chemical Deposition +17

Ripening-assisted asymmetric spalling of Cu-Sn compound spheroids in solder joints on Si wafers

H. K. Kim, K. N. Tu, P. A. Totta · Applied Physics Letters · 1996 · 102 citations

Engineering, Mechanical Engineering, Cu-sn Compound Spheroids +18

A VLSI Bipolar Metallization Design with Three-Level Wiring and Area Array Solder Connections

L. J. Fried, J. Havas, J. S. Lechaton et al. · IBM Journal of Research and Development · 1982 · 57 citations

Engineering, Integrated Circuits, Three-level Wiring +18