SLT Device Metallurgy and its Monolithic Extension

Abstract

The glass-passivated, face-down semiconductor chip joining technology employed in IBM's SLT (Solid Logic Technology), has become not only a fundamental element in the hybrid circuitry of System/360 but also the basis for later metallurgical designs. The “flip-chip,” copper ball terminal, solder reflow technique is comprehensively reviewed and a discussion is given of its extension, through the use of ductile, all-solder terminals, to monolithic applications.