NBE Tech (United States)

Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips

Thomas G. Lei, Jesus N. Calata, Guo‐Quan Lu et al. · IEEE Transactions on Components and Packaging Technologies · 2009 · 236 citations

Engineering, Materials Engineering, Materials Science +17

Migration of Sintered Nanosilver Die-Attach Material on Alumina Substrate Between 250 $^{\circ}\hbox{C}$ and 400 $^{ \circ}\hbox{C}$ in Dry Air

Yunhui Mei, Guo‐Quan Lu, Xu Chen et al. · IEEE Transactions on Device and Materials Reliability · 2010 · 57 citations

Engineering, Materials Engineering, Materials Science +16

Effect of Oxygen Partial Pressure on Silver Migration of Low-Temperature Sintered Nanosilver Die-Attach Material

Yunhui Mei, Guo‐Quan Lu, Xu Chen et al. · IEEE Transactions on Device and Materials Reliability · 2010 · 39 citations

Natural Sciences, Materials Engineering, Materials Science +15

Low-Pressure Joining of Large-Area Devices on Copper Using Nanosilver Paste

Hanguang Zheng, David E. Berry, Jesus N. Calata et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 35 citations

Engineering, Materials Engineering, Materials Science +15

Shrinkage and Sintering Behavior of a Low-Temperature Sinterable Nanosilver Die-Attach Paste

Tao Wang, Meihua Zhao, Xu Chen et al. · Journal of Electronic Materials · 2012 · 33 citations

Engineering, Materials Engineering, Materials Science +11