Shufang Luo - Concepedia

Author

Shufang Luo

NBE Tech (United States)

Also Known As

S. Luo, Shu-Fang Luo, Shufang Luo, Shufang. Luo

Publications

645

Citations

H-Index

Concepts

All Affiliations

NBE Tech (United States)Virginia Tech Tianjin University DEVCOM Army Research Laboratory

About

Shufang Luo is an author at NBE Tech (United States) specializing in engineering, materials science, and optical sensors.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	9	9	572
2	Applied Physics	2	2	272
3	Medicine	1	1	83
4	Biochemistry	1	1	83
5	Biomolecular Engineering	1	1	83

Shufang Luo

Publications

629

Citations

H-Index

Page 1

	Year	Citations
Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips Thomas G. Lei, Jesus N. Calata, Guo‐Quan Lu, IEEE Transactions on Components and Packaging Technologies Low-temperature SinteringEngineeringLow-temperature Sintering TechniqueElectronic DevicesNanoengineering	2009	233
Avidin-biotin coupling as a general method for preparing enzyme-based fiber-optic sensors Shufang Luo, David R. Walt Analytical Chemistry Photonic SensorEngineeringAltmetric Attention ScoreFiber OpticsBiosensors	1989	83
A theoretical investigation of environmental monitoring using surface plasmon resonance waveguide sensors Martin N. Weiss, Ramakant Srivastava, H. P. Groger, Sensors and Actuators A Physical PlasmonicsEnvironmental MonitoringEngineeringSensorsTheoretical Investigation	1995	57
Migration of Sintered Nanosilver Die-Attach Material on Alumina Substrate Between 250 $^{\circ}\hbox{C}$ and 400 $^{ \circ}\hbox{C}$ in Dry Air Yunhui Mei, Guo‐Quan Lu, Xu Chen, IEEE Transactions on Device and Materials Reliability	2010	57
Fiber-optic sensors based on reagent delivery with controlled-release polymers Shufang Luo, David R. Walt Analytical Chemistry AltmetricsPolymer ChemistryOptical MaterialsControlled-release PolymersshufangEngineering	1989	47
Effect of Oxygen Partial Pressure on Silver Migration of Low-Temperature Sintered Nanosilver Die-Attach Material Yunhui Mei, Guo‐Quan Lu, Xu Chen, IEEE Transactions on Device and Materials Reliability Materials ScienceAdvanced PackagingElectrical EngineeringSilver MigrationEngineering	2010	39
Shrinkage and Sintering Behavior of a Low-Temperature Sinterable Nanosilver Die-Attach Paste Tao Wang, Meihua Zhao, Xu Chen, Journal of Electronic Materials Materials ScienceMaterials EngineeringSinteringEngineeringMicrofabrication	2012	33
Investigation of Post-Etch Copper Residue on Direct Bonded Copper (DBC) Substrates Yunhui Mei, Guo‐Quan Lu, Xu Chen, Journal of Electronic Materials Materials ScienceChemical EngineeringEngineeringCorrosionSurface Science	2011	32
Evaluation of Thermal Cycling Reliability of Sintered Nanosilver Versus Soldered Joints by Curvature Measurement Li Jiang, Thomas G. Lei, Khai D. T. Ngo, IEEE Transactions on Components Packaging and Manufacturing Technology Bending CurvaturesEngineeringMechanical EngineeringThermal ConductivityInterconnect (Integrated Circuits)	2014	30
Applications of LPG fiber optical sensors for relative humidity and chemical-warfare-agents monitoring Shufang Luo, Yongcheng Liu, Artur Sucheta, Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE Photonic SensorEngineeringFiber OpticsHumidity SensorRelative Humidity	2002	18

Page 1