Yunhui Mei

Pressureless sintering of nanosilver paste at low temperature to join large area (≥100mm2) power chips for electronic packaging

Shancan Fu, Yunhui Mei, Guo‐Quan Lu et al. · Materials Letters · 2014 · 125 citations

Materials Science, Advanced Packaging, Electrical Engineering +15

A novel multiscale silver paste for die bonding on bare copper by low-temperature pressure-free sintering in air

Jie Li, Xin Li, Lei Wang et al. · Materials & Design · 2017 · 93 citations · Full text

Materials Science, Materials Engineering, Low-temperature Pressure-free Sintering +13

Creep properties of low-temperature sintered nano-silver lap shear joints

Xin Li, Gang Chen, Lei Wang et al. · Materials Science and Engineering A · 2013 · 81 citations

Materials Science, Engineering, Severe Plastic Deformation +6

Applying viscoplastic constitutive models to predict ratcheting behavior of sintered nanosilver lap-shear joint

Gang Chen, Zesheng Zhang, Yunhui Mei et al. · Mechanics of Materials · 2014 · 74 citations

Materials Science, Rheological Constitutive Equation, Viscoplastic Fluid +11

Transient Thermal Performance of IGBT Power Modules Attached by Low-Temperature Sintered Nanosilver

Gang Chen, Dan Han, Yunhui Mei et al. · IEEE Transactions on Device and Materials Reliability · 2011 · 70 citations

Engineering, Igbt Modules, Power Electronics +18