Shancan Fu

Pressureless sintering of nanosilver paste at low temperature to join large area (≥100mm2) power chips for electronic packaging

Shancan Fu, Yunhui Mei, Guo‐Quan Lu et al. · Materials Letters · 2014 · 126 citations

Engineering, Materials Engineering, Materials Science +17

Improving the biofouling resistance of polyamide thin-film composite membrane via grafting polyacrylamide brush on the surface by in-situ atomic transfer radical polymerization

Man Zhao, Yang Yang, Hui Yu et al. · Journal of Membrane Science · 2021 · 65 citations

Engineering, Materials Engineering, Materials Science +16

Reliability Improvement of a Double-Sided IGBT Module by Lowering Stress Gradient Using Molybdenum Buffers

Meiyu Wang, Yunhui Mei, Wen Liu et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2019 · 64 citations

Engineering, Electrical Engineering, Materials Science +17

Reliability Evaluation of Multichip Phase-Leg IGBT Modules Using Pressureless Sintering of Nanosilver Paste by Power Cycling Tests

Shancan Fu, Yunhui Mei, Xin Li et al. · IEEE Transactions on Power Electronics · 2016 · 54 citations

Engineering, Electrical Engineering, Materials Engineering +17

Parametric Study on Pressureless Sintering of Nanosilver Paste to Bond Large-Area (≥100 mm2) Power Chips at Low Temperatures for Electronic Packaging

Shancan Fu, Yunhui Mei, Xin Li et al. · Journal of Electronic Materials · 2015 · 47 citations

Engineering, Materials Engineering, Materials Science +17