Shancan Fu

Pressureless sintering of nanosilver paste at low temperature to join large area (≥100mm2) power chips for electronic packaging

Shancan Fu, Yunhui Mei, Guo‐Quan Lu et al. · Materials Letters · 2014 · 125 citations

Materials Science, Advanced Packaging, Electrical Engineering +15

Reliability Improvement of a Double-Sided IGBT Module by Lowering Stress Gradient Using Molybdenum Buffers

Meiyu Wang, Yunhui Mei, Wen Liu et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2019 · 63 citations

Engineering, Double-sided Igbt Module, Power Electronic Systems +18

Improving the biofouling resistance of polyamide thin-film composite membrane via grafting polyacrylamide brush on the surface by in-situ atomic transfer radical polymerization

Man Zhao, Yang Yang, Hui Yu et al. · Journal of Membrane Science · 2021 · 63 citations

Membrane Structure, Membrane Formation, Engineering +6

Reliability Evaluation of Multichip Phase-Leg IGBT Modules Using Pressureless Sintering of Nanosilver Paste by Power Cycling Tests

Shancan Fu, Yunhui Mei, Xin Li et al. · IEEE Transactions on Power Electronics · 2016 · 54 citations

Engineering, Power Electronics, Interconnect (Integrated Circuits) +16

Parametric Study on Pressureless Sintering of Nanosilver Paste to Bond Large-Area (≥100 mm2) Power Chips at Low Temperatures for Electronic Packaging

Shancan Fu, Yunhui Mei, Xin Li et al. · Journal of Electronic Materials · 2015 · 47 citations

Materials Science, Advanced Packaging, Electrical Engineering +9