A novel multiscale silver paste for die bonding on bare copper by low-temperature pressure-free sintering in air

Metal–metal bonding process using Ag metallo-organic nanoparticles

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Natural Sciences, Materials Engineering, Materials Science +10

Mechanical properties of nano-silver joints as die attach materials

Kim S. Siow · Journal of Alloys and Compounds · 2011 · 384 citations

Natural Sciences, Materials Engineering, Materials Science +12

Low-temperature low-pressure die attach with hybrid silver particle paste

Katsuaki Suganuma, S. Sakamoto, Noriko Kagami et al. · Microelectronics Reliability · 2011 · 283 citations

Natural Sciences, Materials Engineering, Materials Science +8

Sintering and related phenomena

M. Nakahira · Materials Research Bulletin · 1973 · 254 citations

Natural Sciences, Materials Engineering, Materials Science +12

Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging

Jianfeng Yan, Jianfeng Yan, Guisheng Zou et al. · Scripta Materialia · 2012 · 209 citations

Natural Sciences, Materials Engineering, Materials Science +14