Publication | Open Access

A novel multiscale silver paste for die bonding on bare copper by low-temperature pressure-free sintering in air

Materials ScienceMaterials EngineeringLow-temperature Pressure-free SinteringSinteringPowder MetallurgyEngineeringDie BondingMechanical EngineeringApplied PhysicsSurface ScienceBare CopperChip AttachmentElectronic PackagingCladding (Metalworking)MicrostructureMetal Processing