Thomas G. Lei

Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips

Thomas G. Lei, Jesus N. Calata, Guo‐Quan Lu et al. · IEEE Transactions on Components and Packaging Technologies · 2009 · 233 citations

Low-temperature Sintering, Engineering, Low-temperature Sintering Technique +21

A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module

Puqi Ning, Thomas G. Lei, Guo‐Quan Lu et al. · IEEE Transactions on Power Electronics · 2010 · 100 citations

Control of nanosilver sintering attained through organic binder burnout

John G. Bai, Thomas G. Lei, Jesus N. Calata et al. · Journal of materials research/Pratt's guide to venture capital sources · 2007 · 84 citations

Materials Science, Sintering, Engineering +7

Effects of Large-Temperature Cycling Range on Direct Bond Aluminum Substrate

Thomas G. Lei, Jesus N. Calata, Khai D. T. Ngo et al. · IEEE Transactions on Device and Materials Reliability · 2009 · 79 citations

Materials Science, Materials Engineering, Substrate Reliability +15

Sintered nanosilver paste for high-temperature power semiconductor device attachment

Jesus N. Calata, Thomas G. Lei, Guo Quan Lu · International Journal of Materials and Product Technology · 2009 · 52 citations

Engineering, Silicon On Insulator, Silver Joint +22