Thomas G. Lei - Concepedia

Author

Thomas G. Lei

Virginia Tech

Also Known As

T. Guangyin Lei, Thomas G. Lei, Thomas Guangyin Lei, Thomas Lei

Publications

612

Citations

H-Index

Concepts

All Affiliations

Virginia Tech NBE Tech (United States)

About

Thomas G. Lei is an author at Virginia Tech specializing in engineering, electronic packaging, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	7	7	502
2	Materials Science	6	6	490
3	Applied Physics	5	5	460
4	Electrical Engineering	5	5	339
5	Materials Engineering	3	3	121

Thomas G. Lei

Publications

602

Citations

H-Index

Page 1

	Year	Citations
Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips Thomas G. Lei, Jesus N. Calata, Guo‐Quan Lu, IEEE Transactions on Components and Packaging Technologies Low-temperature SinteringEngineeringLow-temperature Sintering TechniqueElectronic DevicesNanoengineering	2009	233
A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module Puqi Ning, Thomas G. Lei, Guo‐Quan Lu, IEEE Transactions on Power Electronics	2010	100
Control of nanosilver sintering attained through organic binder burnout John G. Bai, Thomas G. Lei, Jesus N. Calata, Journal of materials research/Pratt's guide to venture capital sources Materials ScienceSinteringEngineeringMicrofabricationNanomaterials	2007	84
Effects of Large-Temperature Cycling Range on Direct Bond Aluminum Substrate Thomas G. Lei, Jesus N. Calata, Khai D. T. Ngo, IEEE Transactions on Device and Materials Reliability Materials ScienceMaterials EngineeringSubstrate ReliabilityDbc SubstrateHigh Temperature Materials	2009	79
Sintered nanosilver paste for high-temperature power semiconductor device attachment Jesus N. Calata, Thomas G. Lei, Guo Quan Lu International Journal of Materials and Product Technology EngineeringSilicon On InsulatorSilver JointNanoelectronicsElectronic Packaging	2009	52
Evaluation of Thermal Cycling Reliability of Sintered Nanosilver Versus Soldered Joints by Curvature Measurement Li Jiang, Thomas G. Lei, Khai D. T. Ngo, IEEE Transactions on Components Packaging and Manufacturing Technology Bending CurvaturesEngineeringMechanical EngineeringThermal ConductivityInterconnect (Integrated Circuits)	2014	30
A Novel High-Temperature Planar Package for SiC Multi-Chip Phase-Leg Power Module Puqi Ning, Thomas G. Lei, Fred Wang, Electrical EngineeringEngineeringHigh TemperaturePower DeviceAdvanced Packaging (Semiconductors)	2009	12
Low-Temperature Sintering of Nanoscale Silver Paste for Power Chip Attachment Guo‐Quan Lu, Jesus N. Calata, Thomas G. Lei EngineeringMetallic NanomaterialsPower Chip AttachmentAdvanced Packaging (Semiconductors)Materials Fabrication	2008	12

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