Hanguang Zheng

Chip-Bonding on Copper by Pressureless Sintering of Nanosilver Paste Under Controlled Atmosphere

Hanguang Zheng, David Berry, Khai D. T. Ngo et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 64 citations

Engineering, Controlled Atmosphere, Surface Nanotechnology +17

Simplification of the Nanosilver Sintering Process for Large-Area Semiconductor Chip Bonding: Reduction of Hot-Pressing Temperature Below 200/spl deg/C

Kewei Xiao, Jesus N. Calata, Hanguang Zheng et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 39 citations

Low-temperature Sintering, Engineering, Mechanical Engineering +24

Low-Pressure Joining of Large-Area Devices on Copper Using Nanosilver Paste

Hanguang Zheng, David E. Berry, Jesus N. Calata et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 35 citations

Engineering, Low-temperature Joining Technology, Low-pressure Joining +17

Low-pressure (< 5 MPa) Low-temperature Joining of Large-area Chips on Copper Using Nanosilver Paste

Hanguang Zheng, Jesus N. Calata, Khai D. T. Ngo et al. · 2012 7th International Conference on Integrated Power Electronics Systems (CIPS) · 2012 · 21 citations

Engineering, Mechanical Engineering, Low-temperature Joining Technology +17

Temperature Cycling Reliability Assessment of Die Attachment on Bare Copper by Pressureless Nanosilver Sintering

Hanguang Zheng, Khai D. T. Ngo, Guo‐Quan Lu · IEEE Transactions on Device and Materials Reliability · 2015 · 16 citations

Engineering, Microstructure-strength Relationship, Electronic Packaging +21