John G. Bai - Concepedia

Concepedia

Author

John G. Bai

Also Known As

J. Bai, J. G. Bai, J.G. Bai, Jia-Li Bai, Jiali Bai, Jianfeng BAI, Jianting Bai, Jianzhao Bai, Jinyang Bai, John Bai

57

Publications

1.8K

Citations

20

H-Index

61

Concepts

All Affiliations

Virginia Tech University of Washington nLIGHT (United States)Corning (United States)

JG

About

John G. Bai is an author at Virginia Tech specializing in engineering, electronic packaging, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	19	23	1.7K
2	Applied Physics	13	14	1.3K
3	Electrical Engineering	12	12	641
4	Materials Engineering	6	6	599
5	Biomedical Engineering	2	2	55

John G. Bai

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28

Publications

1.8K

Citations

20

H-Index

	Year	Citations
Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material John G. Bai, Ziyang Zhang, Jesus N. Calata, IEEE Transactions on Components and Packaging Technologies EngineeringMetallic NanomaterialsWafer Scale ProcessingNanoelectronicsMicrometer-size Porosity	2006	365
Thermomechanical Reliability of Low-Temperature Sintered Silver Die Attached SiC Power Device Assembly John G. Bai, Guo‐Quan Lu IEEE Transactions on Device and Materials Reliability Materials ScienceMaterials EngineeringThermomechanical ReliabilityEngineeringSuperalloy	2006	207
High-Temperature Operation of SiC Power Devices by Low-Temperature Sintered Silver Die-Attachment John G. Bai, Jian Yin, Zhiye Zhang, IEEE Transactions on Advanced Packaging EngineeringSic Power DevicesSilver PasteAdvanced Packaging (Semiconductors)Nanoelectronics	2007	172
Processing and Characterization of Nanosilver Pastes for Die-Attaching SiC Devices John G. Bai, Jesus N. Calata, Guo‐Quan Lu IEEE Transactions on Electronics Packaging Manufacturing Materials ScienceMaterials EngineeringSic DevicesEngineeringAdvanced Packaging (Semiconductors)	2007	143
Circumferential-mode, quasi-ring-type, magnetoelectric laminate composite—a highly sensitive electric current and∕or vortex magnetic field sensor Shuxiang Dong, John G. Bai, Junyi Zhai, Applied Physics Letters Materials ScienceMagnetismMultiferroicsElectrical EngineeringEngineering	2005	102
Three-dimensional packaging for power semiconductor devices and modules Jesus N. Calata, John G. Bai, Xingsheng Liu, IEEE Transactions on Advanced Packaging Advanced Packaging3D Ic ArchitectureElectrical EngineeringChip-scale PackageEngineering	2005	86
Control of nanosilver sintering attained through organic binder burnout John G. Bai, Thomas G. Lei, Jesus N. Calata, Journal of materials research/Pratt's guide to venture capital sources Materials ScienceSinteringEngineeringMicrofabricationNanomaterials	2007	84
Inkjet printable nanosilver suspensions for enhanced sintering quality in rapid manufacturing John G. Bai, Kevin D. Creehan, Howard A. Kuhn Nanotechnology Materials ScienceSinteringEngineeringMicrofabricationNm Silver Particles	2007	82
A lead-free, low-temperature sintering die-attach technique for high-performance and high-temperature packaging Guo‐Quan Lu, Jesus N. Calata, Zhiye Zhang, EngineeringMechanical EngineeringDie-attach TechniqueSilver-sintering Die-attach TechniqueInterconnect (Integrated Circuits)	2004	63
Mitigation of thermal lensing effect as a brightness limitation of high-power broad area diode lasers John G. Bai, Paul O. Leisher, Shiguo Zhang, Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE	2011	50

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