John G. Bai

Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material

John G. Bai, Ziyang Zhang, Jesus N. Calata et al. · IEEE Transactions on Components and Packaging Technologies · 2006 · 365 citations

Engineering, Metallic Nanomaterials, Wafer Scale Processing +16

Thermomechanical Reliability of Low-Temperature Sintered Silver Die Attached SiC Power Device Assembly

John G. Bai, Guo‐Quan Lu · IEEE Transactions on Device and Materials Reliability · 2006 · 207 citations

Materials Science, Materials Engineering, Thermomechanical Reliability +15

High-Temperature Operation of SiC Power Devices by Low-Temperature Sintered Silver Die-Attachment

John G. Bai, Jian Yin, Zhiye Zhang et al. · IEEE Transactions on Advanced Packaging · 2007 · 172 citations

Engineering, Sic Power Devices, Silver Paste +17

Processing and Characterization of Nanosilver Pastes for Die-Attaching SiC Devices

John G. Bai, Jesus N. Calata, Guo‐Quan Lu · IEEE Transactions on Electronics Packaging Manufacturing · 2007 · 143 citations

Materials Science, Materials Engineering, Sic Devices +15

Circumferential-mode, quasi-ring-type, magnetoelectric laminate composite—a highly sensitive electric current and∕or vortex magnetic field sensor

Shuxiang Dong, John G. Bai, Junyi Zhai et al. · Applied Physics Letters · 2005 · 102 citations · Full text

Materials Science, Magnetism, Multiferroics +14