Xingsheng Liu

Publications

1.4K

Citations

H-Index

2001

Active since

Affiliations

Xi'an Institute of Optics and Precision Mechanics(Current)

Corning (United States)

Virginia Tech

Chinese Academy of Sciences

Tongji University

Xingsheng Liu is an author at Xi'an Institute of Optics and Precision Mechanics specializing in engineering, electronic packaging, and electrical engineering.

ORCID

Top concepts

EngineeringElectrical EngineeringElectronic PackagingOptoelectronicsApplied PhysicsHigh-power LasersMicroelectronicsPhotonicsMaterial ScienceThermal Engineering

Publications per year

2001–2024

Publications

Three-dimensional packaging for power semiconductor devices and modules

Jesus N. Calata, John G. Bai, Xingsheng Liu et al. · IEEE Transactions on Advanced Packaging · 2005 · 86 citations

Advanced Packaging, 3D Ic Architecture, Electrical Engineering +14

Effects of solder joint shape and height on thermal fatigue lifetime

Xingsheng Liu, Guo‐Quan Lu · IEEE Transactions on Components and Packaging Technologies · 2003 · 83 citations

Engineering, Mechanical Engineering, Flip Chip +17

Thermal management strategies for high power semiconductor pump lasers

Xingsheng Liu, Mingxu Hu, C. Caneau et al. · IEEE Transactions on Components and Packaging Technologies · 2006 · 81 citations

Engineering, Thermal Resistance Reduction, Thermal Management Strategies +17

A study on the reliability of indium solder die bonding of high power semiconductor lasers

Xingsheng Liu, Ronald W. Davis, Lawrence C. Hughes et al. · Journal of Applied Physics · 2006 · 70 citations

Electrical Engineering, Advanced Laser Processing, Engineering +15

Packaging of integrated power electronics modules using flip-chip technology

Xingsheng Liu, S. Haque, Jinggang Wang et al. · 2002 · 65 citations

3D Ic Architecture, Electrical Engineering, Chip-scale Package +13

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