Xingsheng Liu - Concepedia

Author

Xingsheng Liu

Xi'an Institute of Optics and Precision Mechanics ORCID

Also Known As

Liu Xingsheng, Xing-Sheng Liu, XingSheng Liu, Xingsheng Liu

198

Publications

1.9K

Citations

H-Index

125

Concepts

All Affiliations

Xi'an Institute of Optics and Precision Mechanics Corning (United States)Virginia Tech Chinese Academy of Sciences Tongji University

About

Xingsheng Liu is an author at Xi'an Institute of Optics and Precision Mechanics specializing in engineering, electronic packaging, and electrical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	20	47	1.3K
2	Applied Physics	12	20	441
3	Natural Sciences	3	3	51
4	Medicine	2	2	26
5	Education	1	1	10

Xingsheng Liu

Publications

1.4K

Citations

H-Index

Page 1

	Year	Citations
Three-dimensional packaging for power semiconductor devices and modules Jesus N. Calata, John G. Bai, Xingsheng Liu, IEEE Transactions on Advanced Packaging Advanced Packaging3D Ic ArchitectureElectrical EngineeringChip-scale PackageEngineering	2005	86
Effects of solder joint shape and height on thermal fatigue lifetime Xingsheng Liu, Guo‐Quan Lu IEEE Transactions on Components and Packaging Technologies EngineeringMechanical EngineeringFlip ChipDamage MechanismElectron Microscopy	2003	83
Thermal management strategies for high power semiconductor pump lasers Xingsheng Liu, Mingxu Hu, C. Caneau, IEEE Transactions on Components and Packaging Technologies EngineeringThermal Resistance ReductionThermal Management StrategiesHigh-power LasersSemiconductor Lasers	2006	81
A study on the reliability of indium solder die bonding of high power semiconductor lasers Xingsheng Liu, Ronald W. Davis, Lawrence C. Hughes, Journal of Applied Physics Electrical EngineeringAdvanced Laser ProcessingEngineeringDestructive Failure AnalysisHardware Reliability	2006	70
Packaging of integrated power electronics modules using flip-chip technology Xingsheng Liu, S. Haque, Jinggang Wang, 3D Ic ArchitectureElectrical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)	2002	65
Three-dimensional flip-chip on flex packaging for power electronics applications Xingsheng Liu, S. Haque, Guo‐Quan Lu IEEE Transactions on Advanced Packaging EngineeringPower ElectronicsInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)Nanoelectronics	2001	55
Stacked solder bumping technology for improved solder joint reliability Xingsheng Liu, Shuangyan Xu, Guo‐Quan Lu, Microelectronics Reliability EngineeringAdvanced Packaging (Semiconductors)Hardware ReliabilityChip AttachmentElectronic Packaging	2001	51
Risley-prism-based multi-beam scanning LiDAR for high-resolution three-dimensional imaging Anhu Li, Xingsheng Liu, Jianfeng Sun, Optics and Lasers in Engineering EngineeringBiomedical ImagingHigh-resolution Three-dimensional ImagingLidarLaser-based Sensor	2021	48
Study of the mechanism of &#x201C;smile&#x201D; in high power diode laser arrays and strategies in improving near-field linearity Jingwei Wang, Zhenbang Yuan, Kang Li-jun, Optical PumpingPhotonicsElectrical EngineeringEngineeringLaser Science	2009	38
Forward and inverse solutions for three-element Risley prism beam scanners Anhu Li, Xingsheng Liu, Wansong Sun Optics Express EngineeringThird PrismAerospace EngineeringMechatronicsMechanical Systems	2017	38

Page 1