S. Haque

An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures

S. Haque, Kun Xing, Ray‐Lee Lin et al. · IEEE Transactions on Advanced Packaging · 1999 · 74 citations

Engineering, Prototype Modules, Power Devices +24

Packaging of integrated power electronics modules using flip-chip technology

Xingsheng Liu, S. Haque, Jinggang Wang et al. · 2002 · 65 citations

3D Ic Architecture, Electrical Engineering, Chip-scale Package +13

Three-dimensional flip-chip on flex packaging for power electronics applications

Xingsheng Liu, S. Haque, Guo‐Quan Lu · IEEE Transactions on Advanced Packaging · 2001 · 55 citations

Engineering, Power Electronics, Interconnect (Integrated Circuits) +18

Electric and thermal transient effects in high power optical devices

Gábor Farkas, S. Haque, Frank Wall et al. · 2004 · 54 citations

Optical Materials, Engineering, Optical Transmission System +22

Miniaturization of Slot Antennas Using Wire Loading

Bratin Ghosh, S. Haque, Nageswara Rao Yenduri · IEEE Antennas and Wireless Propagation Letters · 2013 · 39 citations

Electrical Engineering, Engineering, Antenna +9