Rabih Khazaka

Survey of High-Temperature Reliability of Power Electronics Packaging Components

Rabih Khazaka, L. Mendizabal, David Henry et al. · IEEE Transactions on Power Electronics · 2014 · 364 citations

Wide-bandgap Semiconductor, Engineering, Encapsulation Materials +19

Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability

Rabih Khazaka, L. Mendizabal, David Henry · Journal of Electronic Materials · 2014 · 185 citations

Materials Science, Engineering, Durability Performance +8

Evaluation of Encapsulation Materials for High-Temperature Power Device Packaging

Marie‐Laure Locatelli, Rabih Khazaka, Sombel Diaham et al. · IEEE Transactions on Power Electronics · 2013 · 87 citations

Improved Encapsulation Performance, Engineering, Encapsulation Materials +16

Polyimide lifetime under partial discharge aging: effects of temperature, pressure and humidity

E. Sili, Jean-Pascal Cambronne, Nicolas Naudé et al. · IEEE Transactions on Dielectrics and Electrical Insulation · 2013 · 72 citations

Materials Science, Electrical Engineering, Polyimide Lifetime +10

Effects of mechanical stresses, thickness and atmosphere on aging of polyimide thin films at high temperature

Rabih Khazaka, M.L. Locatelli, Sombel Diaham et al. · Polymer Degradation and Stability · 2012 · 37 citations

Materials Science, Engineering, Mechanical Engineering +8