Jeong‐Won Yoon

Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints

Jeong‐Won Yoon, Bo‐In Noh, Bong-Kyun Kim et al. · Journal of Alloys and Compounds · 2009 · 140 citations

Natural Sciences, Materials Engineering, Materials Science +13

IMC morphology, interfacial reaction and joint reliability of Pb-free Sn–Ag–Cu solder on electrolytic Ni BGA substrate

Jeong‐Won Yoon, Sang-Won Kim, Seung‐Boo Jung · Journal of Alloys and Compounds · 2004 · 125 citations

Natural Sciences, Materials Engineering, Materials Science +13

Intermetallic compound layer growth at the interface between Sn–Cu–Ni solder and Cu substrate

Jeong‐Won Yoon, Young‐Ho Lee, Dae‐Gon Kim et al. · Journal of Alloys and Compounds · 2004 · 111 citations

Natural Sciences, Materials Engineering, Materials Science +9

Interfacial reaction and mechanical properties of eutectic Sn–0.7Cu/Ni BGA solder joints during isothermal long-term aging

Jeong‐Won Yoon, Sang-Won Kim, Seung‐Boo Jung · Journal of Alloys and Compounds · 2004 · 109 citations

Natural Sciences, Materials Engineering, Materials Science +14

Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint

Jeong‐Won Yoon, Bo‐In Noh, Seung‐Boo Jung · Journal of Electronic Materials · 2011 · 90 citations

Natural Sciences, Materials Engineering, Materials Science +16