Concepedia

Jeong‐Won Yoon

JY

111

Publications

3.9K

Citations

37

H-Index

2002

Active since

Affiliations

Sungkyunkwan University(Current)

Korea Institute of Industrial Technology

Chungbuk National University

Korea University of Science and Technology

Samsung (South Korea)

Jeong‐Won Yoon is an author at Sungkyunkwan University specializing in engineering, materials science, and materials engineering.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMaterials EngineeringApplied PhysicsMechanical EngineeringSurface ScienceElectrical EngineeringCorrosionMicrostructure

Publications per year

2002–2023

111

Publications

111

Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints

Jeong‐Won Yoon, Bo‐In Noh, Bong-Kyun Kim et al. · Journal of Alloys and Compounds · 2009 · 139 citations

Materials Science, Materials Engineering, Chemical Engineering +8

IMC morphology, interfacial reaction and joint reliability of Pb-free Sn–Ag–Cu solder on electrolytic Ni BGA substrate

Jeong‐Won Yoon, Sang-Won Kim, Seung‐Boo Jung · Journal of Alloys and Compounds · 2004 · 124 citations

Materials Science, Electrical Engineering, Engineering +5

Intermetallic compound layer growth at the interface between Sn–Cu–Ni solder and Cu substrate

Jeong‐Won Yoon, Young‐Ho Lee, Dae‐Gon Kim et al. · Journal of Alloys and Compounds · 2004 · 110 citations

Materials Science, Materials Engineering, Electrical Engineering +9

Interfacial reaction and mechanical properties of eutectic Sn–0.7Cu/Ni BGA solder joints during isothermal long-term aging

Jeong‐Won Yoon, Sang-Won Kim, Seung‐Boo Jung · Journal of Alloys and Compounds · 2004 · 109 citations

Materials Science, Isothermal Long-term Aging, Interfacial Reaction +8

Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint

Jeong‐Won Yoon, Bo‐In Noh, Seung‐Boo Jung · Journal of Electronic Materials · 2011 · 90 citations

Materials Engineering, Materials Science, Friction Welding +11

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