Concepedia

Sang-Won Kim

SK

7

Publications

570

Citations

7

H-Index

2004

Active since

Affiliations

Sungkyunkwan University(Current)

Sang-Won Kim is an author at Sungkyunkwan University specializing in engineering, materials science, and applied physics.

Top concepts

EngineeringMaterial ScienceApplied PhysicsElectronic PackagingMaterials EngineeringMicrostructureCorrosionElectrical EngineeringMechanical EngineeringOsteoarthritis

Publications per year

2004–2005

7

Publications

7

IMC morphology, interfacial reaction and joint reliability of Pb-free Sn–Ag–Cu solder on electrolytic Ni BGA substrate

Jeong‐Won Yoon, Sang-Won Kim, Seung‐Boo Jung · Journal of Alloys and Compounds · 2004 · 124 citations

Materials Science, Electrical Engineering, Engineering +5

Interfacial reaction and mechanical properties of eutectic Sn–0.7Cu/Ni BGA solder joints during isothermal long-term aging

Jeong‐Won Yoon, Sang-Won Kim, Seung‐Boo Jung · Journal of Alloys and Compounds · 2004 · 109 citations

Materials Science, Isothermal Long-term Aging, Interfacial Reaction +8

Reliability investigation and interfacial reaction of ball-grid-array packages using the lead-free Sn-Cu solder

Jeong‐Won Yoon, Sang-Won Kim, Ja‐Myeong Koo et al. · Journal of Electronic Materials · 2004 · 83 citations

Materials Engineering, Materials Science, Electrical Engineering +6

Interfacial reactions and shear strengths between Sn-Ag-based Pb-free solder balls and Au/EN/Cu metallization

Sang-Won Kim, Jeong‐Won Yoon, Seung‐Boo Jung · Journal of Electronic Materials · 2004 · 82 citations

Materials Science, Materials Engineering, Interfacial Reactions +11

IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging

Jeong‐Won Yoon, Sang-Won Kim, Seung‐Boo Jung · MATERIALS TRANSACTIONS · 2004 · 73 citations · Full text

Imc Layer, Imc Growth, Engineering +16

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