Concepedia

Ja‐Myeong Koo

JK

20

Publications

614

Citations

17

H-Index

2004

Active since

Affiliations

Sungkyunkwan University(Current)

Samsung (South Korea)

Ja‐Myeong Koo is an author at Sungkyunkwan University specializing in engineering, materials science, and electronic packaging.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMechanical EngineeringApplied PhysicsMicroelectronicsMaterials EngineeringElectrical EngineeringMicrostructureMechanics Of Materials

Publications per year

2004–2020

20

Publications

20

Reliability investigation and interfacial reaction of ball-grid-array packages using the lead-free Sn-Cu solder

Jeong‐Won Yoon, Sang-Won Kim, Ja‐Myeong Koo et al. · Journal of Electronic Materials · 2004 · 83 citations

Materials Engineering, Materials Science, Electrical Engineering +6

Effect of substrate metallization on mechanical properties of Sn–3.5Ag BGA solder joints with multiple reflows

Ja‐Myeong Koo, Seung‐Boo Jung · Microelectronic Engineering · 2005 · 48 citations

Materials Science, Materials Engineering, Engineering +7

Microstructural evolution of Sn-rich Au–Sn/Ni flip-chip solder joints under high temperature storage testing conditions

Jeong‐Won Yoon, Hyun-Suk Chun, Ja‐Myeong Koo et al. · Scripta Materialia · 2007 · 45 citations

Materials Science, Materials Engineering, High Temperature Storage +8

Nanoscale‐Dewetting‐Based Direct Interconnection of Microelectronics for a Deterministic Assembly of Transfer Printing

Ju Seung Lee, Seung‐Ji Kang, Joo Hwan Shin et al. · Advanced Materials · 2020 · 42 citations

Engineering, Polymer Adhesive, Transfer Printing +19

Laser-Induced Graphene on Additive Manufacturing Parts

Lishi Jiao, Zhong Yang Chua, Seung Ki Moon et al. · Nanomaterials · 2019 · 41 citations · Full text

Materials Science, Chemical Engineering, Advanced Laser Processing +14

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