Bo‐In Noh

Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints

Jeong‐Won Yoon, Bo‐In Noh, Bong-Kyun Kim et al. · Journal of Alloys and Compounds · 2009 · 140 citations

Natural Sciences, Materials Engineering, Materials Science +13

Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint

Jeong‐Won Yoon, Bo‐In Noh, Seung‐Boo Jung · Journal of Electronic Materials · 2011 · 90 citations

Natural Sciences, Materials Engineering, Materials Science +16

Effect of surface finish material on printed circuit board for electrochemical migration

Bo‐In Noh, Jong-Bum Lee, Seung‐Boo Jung · Microelectronics Reliability · 2007 · 77 citations

Natural Sciences, Materials Engineering, Materials Science +16

Sequential interfacial intermetallic compound formation of Cu6Sn5 and Ni3Sn4 between Sn–Ag–Cu solder and ENEPIG substrate during a reflow process

Jeong‐Won Yoon, Jeong‐Won Yoon, Bo‐In Noh et al. · Journal of Alloys and Compounds · 2011 · 76 citations

Natural Sciences, Materials Engineering, Materials Science +14

Evaluation of Electrochemical Migration on Flexible Printed Circuit Boards with Different Surface Finishes

Bo‐In Noh, Jeong‐Won Yoon, Won-Sik Hong et al. · Journal of Electronic Materials · 2009 · 51 citations

Natural Sciences, Materials Engineering, Materials Science +16