Effect of surface finish material on printed circuit board for electrochemical migration

Electrochemical migration tests of solder alloys in pure water

Tatsuya Takemoto, R. M. Latanision, Thomas W. Eagar et al. · Corrosion Science · 1997 · 80 citations

Materials Science, Electrometallurgy, Chemical Engineering +5

Comparing migratory resistive short formation abilities of conductor systems applied in advanced interconnection systems

Gábor Harsányi, George Inzelt · Microelectronics Reliability · 2001 · 68 citations

Electrical Engineering, Advanced Interconnection Systems, Engineering +10

Irregular effect of chloride impurities on migration failure reliability: contradictions or understandable?

Gábor Harsányi · Microelectronics Reliability · 1999 · 63 citations

Transport Phenomena, Migration Failure Reliability, Irregular Effect +1

Electrochemical migration characteristics of eutectic SnPb solder alloy in printed circuit board

Shin-Bok Lee, Young‐Ran Yoo, Ja-Young Jung et al. · Thin Solid Films · 2005 · 61 citations

Materials Science, Electrical Engineering, Electromigration Technique +6

Corrosion of metallic materials

M. Tullmin, P.R. Roberge · IEEE Transactions on Reliability · 1995 · 50 citations

Materials Engineering, Materials Science, Electrical Engineering +13