Concepedia

Jong-Bum Lee

JL

6

Publications

186

Citations

6

H-Index

2003

Active since

Affiliations

Sungkyunkwan University(Current)

Jong-Bum Lee is an author at Sungkyunkwan University specializing in engineering, electronic packaging, and materials science.

Top concepts

EngineeringMaterial ScienceElectronic PackagingElectrical EngineeringMechanical EngineeringCorrosionMaterials EngineeringEducationVibrationKinematics

Publications per year

2003–2014

6

Publications

6

Effect of surface finish material on printed circuit board for electrochemical migration

Bo‐In Noh, Jong-Bum Lee, Seung‐Boo Jung · Microelectronics Reliability · 2007 · 72 citations

Materials Science, Electrical Engineering, Chemical Engineering +12

Reliability Investigation of Cu/In TLP Bonding

Jong-Bum Lee, How Yuan Hwang, Minwoo Rhee · Journal of Electronic Materials · 2014 · 54 citations

Materials Science, Materials Engineering, Electrical Engineering +8

Mechanical and Electrical Properties of Cu/Sn-3.5Ag/Cu Ball Grid Array (BGA) Solder Joints after Multiple Reflows

Ja‐Myeong Koo, Bui Quoc Vu, Yuna Kim et al. · Journal of Electronic Materials · 2007 · 18 citations

Materials Engineering, Materials Science, Electrical Engineering +6

A Study on the Characteristics of Vibration in Seat System

Sungshik Baik, Jong-Bum Lee, Jin-Kwan Suh · SAE technical papers on CD-ROM/SAE technical paper series · 2003 · 18 citations

Tactile Response, Engineering, Mechanical Engineering +18

Reliability of Au bump flip chip packages with adhesive materials using four-point bending test

Bo‐In Noh, Jeong‐Won Yoon, Jong‐Woong Kim et al. · International Journal of Adhesion and Adhesives · 2009 · 13 citations

Materials Science, Chip-scale Package, Engineering +10

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