Concepedia

How Yuan Hwang

HY

Statistics

Publications

8

Citations

448

H-Index

8

Active since

2014

Affiliations

Agency for Science, Technology and Research(Current)

Institute of Microelectronics

Singapore Science Park

Gwangju Institute of Science and Technology

University College Cork

How Yuan Hwang is an author at Agency for Science, Technology and Research specializing in electronic packaging, microelectronics, and engineering.

Top concepts

EngineeringMicroelectronicsElectronic PackagingElectrical EngineeringMicrofabricationPhotonicsOptoelectronicsAdvanced PackagingIntegrated CircuitsComputer Engineering

Publications per year

2014–2017

8

Publications

8

Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices

Lee Carroll, Junsu Lee, Carmelo Scarcella et al. · Applied Sciences · 2016 · 236 citations · Full text

Optical Materials, Engineering, Device Integration +21

Reliability Investigation of Cu/In TLP Bonding

Jong-Bum Lee, How Yuan Hwang, Minwoo Rhee · Journal of Electronic Materials · 2014 · 54 citations

Materials Science, Materials Engineering, Electrical Engineering +8

Miniaturized Double Side Cooling Packaging for High Power 3 Phase SiC Inverter Module with Junction Temperature over 220°C

Daniel Rhee Min Woo, How Yuan Hwang, Jerry Aw Jie Li et al. · 2016 · 34 citations

Engineering, Double Side, High Power 3 +17

High power SiC inverter module packaging solutions for junction temperature over 220°C

Daniel Rhee Min Woo, How Yuan Hwang, Jerry Aw Jie Li et al. · 2014 · 31 citations

77-GHz Automotive Radar Sensor System With Antenna Integrated Package

Ka Fai Chang, Rui Li, Jin Cheng et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 30 citations

Transceiver Bare Die, Engineering, Electromagnetic Compatibility +17

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