R.J. Stierman

Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability

Kejun Zeng, R.J. Stierman, Tz-Cheng Chiu et al. · Journal of Applied Physics · 2004 · 437 citations

Natural Sciences, Materials Engineering, Materials Science +16

Effect of thermal aging on board level drop reliability for Pb-free BGA packages

Tz-Cheng Chiu, Kejun Zeng, R.J. Stierman et al. · 2004 · 248 citations

Engineering, Materials Engineering, Materials Science +17

The root cause of black pad failure of solder joints with electroless Ni/Immersion gold plating

Kejun Zeng, R.J. Stierman, D.C. Abbott et al. · JOM · 2006 · 81 citations

Engineering, Materials Engineering, Materials Science +15

Thickness dependence of the anisotropy in thermal expansion of PMDA-ODA and BPDA-PDA thin films

Huey‐Chiang Liou, Paul S. Ho, R.J. Stierman · Thin Solid Films · 1999 · 46 citations

Natural Sciences, Materials Engineering, Materials Science +16

Influence of composition on some physical properties of the narrow band material CeSn3

K. A. Gschneidner, S. K. Dhar, R.J. Stierman et al. · Journal of Magnetism and Magnetic Materials · 1985 · 39 citations

Natural Sciences, Materials Science, Physics +12