The root cause of black pad failure of solder joints with electroless Ni/Immersion gold plating - Concepedia

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The root cause of black pad failure of solder joints with electroless Ni/Immersion gold plating

81

Citations

25

References

2006

Year

Kejun Zeng, R.J. Stierman, D.C. Abbott, Masood Murtuza

Materials ScienceMaterials EngineeringEngineeringCorrosionRoot CauseBlack Pad FailureMechanical EngineeringSolder JointsElectronic Packaging

References

	Year	Citations

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