Concepedia

Author

Masood Murtuza

Texas Instruments (United States)

Also Known As

M. Murtuza, Masood Murtuza

16

Publications

274

Citations

8

H-Index

22

Concepts

All Affiliations

Texas Instruments (United States)Auburn University
MM

About

Masood Murtuza is an author at Texas Instruments (United States) specializing in engineering, electronic packaging, and materials science.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

7

7

251

2

Materials Science

7

7

251

3

Electrical Engineering

5

5

103

4

Materials Engineering

5

5

165

5

Applied Physics

4

4

84

Masood Murtuza

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7

Publications

251

Citations

7

H-Index

YearCitations

The root cause of black pad failure of solder joints with electroless Ni/Immersion gold plating

Kejun Zeng, R.J. Stierman, D.C. Abbott,

JOM

2006

81

Computer Aided Stress Modeling for Optimizing Plastic Package Reliability

Steven K. Groothuis, W. Schroen, Masood Murtuza

Reliability physics

1985

67

Elimination of bond-pad damage through structural reinforcement of intermetal dielectrics

Mukesh Saran, Robert G. Cox, C. Wayne Martin,

1998

27

Microstructural Indicators for Prognostication of Copper–Aluminum Wire Bond Reliability Under High-Temperature Storage and Temperature Humidity

Pradeep Lall, Shantanu Deshpande, Luu Nguyen,

IEEE Transactions on Components Packaging and Manufacturing Technology

2016

25

Reliability of lead-free SAC electronics under simultaneous exposure to high temperature and vibration

Pradeep Lall, Geeta Limaye, Jeff Suhling,

2012

19

Root Cause of Black Pad Failure of Solder Joints with Electroless Nickel/Immersion Gold Plating

Kejun Zeng, R.J. Stierman, D.C. Abbott,

2006

19

Prognostication of copper-aluminum wirebond reliability under high temperature storage and temperature-humidity

Pradeep Lall, Shantanu Deshpande, Luu Nguyen,

2014

13

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