Masood Murtuza

The root cause of black pad failure of solder joints with electroless Ni/Immersion gold plating

Kejun Zeng, R.J. Stierman, D.C. Abbott et al. · JOM · 2006 · 81 citations

Materials Science, Materials Engineering, Engineering +6

Computer Aided Stress Modeling for Optimizing Plastic Package Reliability

Steven K. Groothuis, W. Schroen, Masood Murtuza · Reliability physics · 1985 · 67 citations

Materials Science, Temperature Cycling, Reliability Engineering +15

Elimination of bond-pad damage through structural reinforcement of intermetal dielectrics

Mukesh Saran, Robert G. Cox, C. Wayne Martin et al. · 1998 · 27 citations

Materials Science, Materials Engineering, Electrical Engineering +13

Microstructural Indicators for Prognostication of Copper–Aluminum Wire Bond Reliability Under High-Temperature Storage and Temperature Humidity

Pradeep Lall, Shantanu Deshpande, Luu Nguyen et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2016 · 25 citations

Engineering, Microstructural Indicators, Mechanical Engineering +22

Reliability of lead-free SAC electronics under simultaneous exposure to high temperature and vibration

Pradeep Lall, Geeta Limaye, Jeff Suhling et al. · 2012 · 19 citations

Engineering, Lead-free Sac Electronics, Underhood Applications +22