Concepedia

Luu Nguyen

LN

83

Publications

2.9K

Citations

26

H-Index

1986

Active since

Affiliations

Texas Instruments (United States)(Current)

University of Bologna

Georgia Institute of Technology

Purdue University West Lafayette

The University of Texas at Arlington

Luu Nguyen is an author at Texas Instruments (United States) specializing in engineering, electronic packaging, and materials science.

Top concepts

EngineeringElectronic PackagingMaterial ScienceMechanical EngineeringMicroelectronicsElectrical EngineeringApplied PhysicsMechanics Of MaterialsMicrofabricationMaterials Engineering

Publications per year

1986–2020

83

Publications

83

Solder joint fatigue models: review and applicability to chip scale packages

W.W Lee, Luu Nguyen, Guna S Selvaduray · Microelectronics Reliability · 2000 · 504 citations

Reliability Engineering, Engineering, Chip-scale Package +10

Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction

Woon‐Seop Choi, T. Y. Lee, K. N. Tu et al. · Acta Materialia · 2003 · 167 citations

Materials Science, Engineering, Surface Science +6

Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints

Zhang Lingyun, Shengquan Ou, Joanne Huang et al. · Applied Physics Letters · 2006 · 160 citations

Engineering, Void Growth Velocity, Interconnect (Integrated Circuits) +18

Plastic encapsulated microelectronics

Michael Pecht, Luu Nguyen · 1995 · 158 citations

Advanced Packaging, Materials Science, Miniaturization +8

Tin whiskers studied by focused ion beam imaging and transmission electron microscopy

George T. T. Sheng, Christine Hu, Woon‐Seop Choi et al. · Journal of Applied Physics · 2002 · 139 citations

Engineering, Transmission Electron Microscopy, Microscopy +19

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