Luu Nguyen - Concepedia

Author

Luu Nguyen

Also Known As

L. Nguyen, L. T. Nguyen, L.T Nguyen, L.T. Nguyen, LUU T. NGUYEN, Lan Nho Nguyen, Le Thien Nghi Nguyen, Lu Dinh Khoa Nguyen, Luong Van Minh Nguyen, Luu Hanh Nguyen

225

Publications

3.4K

Citations

H-Index

120

Concepts

All Affiliations

Texas Instruments (United States)University of Bologna Georgia Institute of Technology Purdue University West Lafayette The University of Texas at Arlington

About

Luu Nguyen is an author at Texas Instruments (United States) specializing in engineering, electronic packaging, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	26	75	2.8K
2	Applied Physics	15	22	1K
3	Natural Sciences	2	2	30
4	Health Sciences	1	1	32
5	Biomedical Engineering	1	1	32

Luu Nguyen

Publications

2.9K

Citations

H-Index

Page 1

	Year	Citations
Solder joint fatigue models: review and applicability to chip scale packages W.W Lee, Luu Nguyen, Guna S Selvaduray Microelectronics Reliability Reliability EngineeringEngineeringChip-scale PackageHardware ReliabilityMechanical Engineering	2000	504
Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction Woon‐Seop Choi, T. Y. Lee, K. N. Tu, Acta Materialia Materials ScienceEngineeringSurface ScienceApplied PhysicsTin Whiskers	2003	167
Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints Zhang Lingyun, Shengquan Ou, Joanne Huang, Applied Physics Letters EngineeringVoid Growth VelocityInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)Void Propagation	2006	160
Plastic encapsulated microelectronics Michael Pecht, Luu Nguyen Advanced PackagingMaterials ScienceMiniaturizationEngineeringFlexible Electronics	1995	158
Tin whiskers studied by focused ion beam imaging and transmission electron microscopy George T. T. Sheng, Christine Hu, Woon‐Seop Choi, Journal of Applied Physics EngineeringTransmission Electron MicroscopyMicroscopyTin WhiskersVacuum Device	2002	139
Optimization of copper wire bonding on Al-Cu metallization Luu Nguyen, David B. McDonald, A.R. Danker, IEEE Transactions on Components Packaging and Manufacturing Technology Part A Materials EngineeringMaterials ScienceElectrical EngineeringEngineeringAdvanced Packaging (Semiconductors)	1995	80
Underfill of flip chip on laminates: simulation and validation Luu Nguyen, C. Quentin, P. Fine, IEEE Transactions on Components and Packaging Technologies EngineeringFluid MechanicsMechanical EngineeringFlow Front UniformityComputer-aided Design	1999	77
Aging and creep behavior of Sn3.9Ag0.6Cu solder alloy Qiang Xiao, Luu Nguyen, W. D. Armstrong Materials EngineeringMaterials ScienceEutectic PbsnEngineeringSuperalloy	2004	71
Reliability of Postmolded IC Packages Luu Nguyen Journal of Electronic Packaging EngineeringPostmolded Ic PackagesHardware SecurityReliability EngineeringAdvanced Packaging (Semiconductors)	1993	63
Drop test reliability of wafer level chip scale packages M. Alajoki, Luu Nguyen, J.K. Kivilahti EngineeringReliability EngineeringCorrosionSolder InterconnectionsElectronic Packaging	2005	57

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