Joanne Huang

Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints

Zhang Lingyun, Shengquan Ou, Joanne Huang et al. · Applied Physics Letters · 2006 · 161 citations

Engineering, Electrical Engineering, Materials Science +15

Lead-Free and PbSn Bump Electromigration Testing

S.A. Gee, N. Kelkar, Joanne Huang et al. · 2005 · 46 citations

Engineering, Electrical Engineering, Materials Engineering +17

Extending drift-diffusion paradigm into the era of FinFETs and nanowires

Munkang Choi, Victor Moroz, Lee Smith et al. · 2015 · 27 citations

Engineering, Electrical Engineering, Microelectronics +16

Modeling and optimization of group IV and III–V FinFETs and nano-wires

Victor Moroz, Lee Smith, Joanne Huang et al. · 2014 · 26 citations

Engineering, Computer Engineering, Electrical Engineering +17

Transistor design for 5nm and beyond: Slowing down electrons to speed up transistors

Victor Moroz, Joanne Huang, Reza Arghavani · 2016 · 21 citations

Engineering, Electrical Engineering, Materials Science +17