Concepedia

N. Kelkar

NK

10

Publications

226

Citations

10

H-Index

1997

Active since

Affiliations

Texas Instruments (United States)(Current)

University of Maryland, College Park

Binghamton University

N. Kelkar is an author at Texas Instruments (United States) specializing in engineering, electrical engineering, and electronic packaging.

Top concepts

EngineeringElectronic PackagingElectrical EngineeringMicroelectronicsReliability EngineeringReliabilityComputer EngineeringMicrofabricationIndustrial EngineeringMechanical Engineering

Publications per year

1997–2005

10

Publications

10

Lead-Free and PbSn Bump Electromigration Testing

S.A. Gee, N. Kelkar, Joanne Huang et al. · 2005 · 46 citations

Materials Science, Advanced Packaging, Electrical Engineering +15

Solder joint reliability model vath modified Darveaux's equations for the micro smd wafer level-chip scale package family

L. Zhang, R. Sitaraman, V. Patwardhan et al. · 2004 · 30 citations

Micro Smd, Engineering, Similar Package Configurations +19

Criteria for the assessment of reliability models

Michael Pecht, Alka Shukla, N. Kelkar et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1997 · 28 citations

Reliability Models, Engineering, Industrial Engineering +17

MicroSMD-a wafer level chip scale package

N. Kelkar, Reenu Mathew, Hem Takiar et al. · IEEE Transactions on Advanced Packaging · 2000 · 23 citations

Electrical Engineering, Chip-scale Package, Engineering +13

Numerical and experimental analysis of large passivation opening for solder joint reliability improvement of micro SMD packages

Li Zhang, Vivek Arora, Luu Nguyen et al. · Microelectronics Reliability · 2004 · 21 citations

Micro Smd Packages, Electrical Engineering, Reliability Engineering +10

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