S.A. Gee

Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints

Zhang Lingyun, Shengquan Ou, Joanne Huang et al. · Applied Physics Letters · 2006 · 160 citations

Engineering, Void Growth Velocity, Interconnect (Integrated Circuits) +18

The Quality of Die-Attachment and Its Relationship to Stresses and Vertical Die-Cracking

Chris van Kessel, S.A. Gee, Jeremiah G. Murphy · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1983 · 93 citations

Engineering, Mechanical Engineering, Residual Stress +17

Strain-gauge mapping of die surface stresses

S.A. Gee, W.F. van den Bogert, V. Akylas · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1989 · 70 citations

Engineering, Mechanical Engineering, Residual Stress +18

Lead-Free and PbSn Bump Electromigration Testing

S.A. Gee, N. Kelkar, Joanne Huang et al. · 2005 · 46 citations

Materials Science, Advanced Packaging, Electrical Engineering +15

The Design And Calibration Of A Semiconductor Strain Gauge Array

S.A. Gee, V. Akylas, W.F. van den Bogert · 2005 · 42 citations

Electrical Engineering, Engineering, Strain Localization +7