Concepedia

Shengquan Ou

SO

7

Publications

290

Citations

7

H-Index

2004

Active since

Affiliations

University of California, Los Angeles(Current)

City University of Hong Kong

Shengquan Ou is an author at University of California, Los Angeles specializing in engineering, electronic packaging, and materials science.

Top concepts

EngineeringElectronic PackagingMaterial ScienceMaterials EngineeringApplied PhysicsMicroelectronicsElectrical EngineeringCorrosionMicrostructureMechanics Of Materials

Publications per year

2004–2008

7

Publications

7

Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints

Zhang Lingyun, Shengquan Ou, Joanne Huang et al. · Applied Physics Letters · 2006 · 160 citations

Engineering, Void Growth Velocity, Interconnect (Integrated Circuits) +18

Micro-impact test on lead-free BGA balls on Au/electrolytic Ni/Cu bond pad

Shengquan Ou, Yuhuan Xu, K. N. Tu et al. · 2005 · 52 citations

Engineering, Mechanical Engineering, Si Chip +17

Electromigration and critical product in eutectic SnPb solder lines at 100°C

R. Agarwal, Shengquan Ou, K. N. Tu · Journal of Applied Physics · 2006 · 30 citations

Materials Engineering, Materials Science, Electrical Engineering +15

A study of electromigration in Sn3.5Ag and Sn3.8Ag0.7Cu solder lines

Shengquan Ou, K. N. Tu · 2005 · 14 citations

Engineering, Interconnect (Integrated Circuits), Advanced Packaging (Semiconductors) +16

Measurement of impact toughness of eutectic SnPb and SnAgCu solder joints in ball grid array by mini-impact tester

Yuhuan Xu, Shengquan Ou, K. N. Tu et al. · Journal of materials research/Pratt's guide to venture capital sources · 2008 · 12 citations

Materials Science, Damage Mechanism, Engineering +8

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