Concepedia

V. Patwardhan

VP

2

Publications

41

Citations

2

H-Index

2003

Active since

Affiliations

Binghamton University(Current)

Texas Instruments (United States)

V. Patwardhan is an author at Binghamton University specializing in computer engineering, electrical engineering, and electronic packaging.

Top concepts

EngineeringReliabilityMicroelectronicsComputer EngineeringElectronic PackagingElectrical EngineeringMechanical EngineeringMechanics Of MaterialsReliability EngineeringMicrostructure

Publications per year

2003–2004

2

Publications

2

Solder joint reliability model vath modified Darveaux's equations for the micro smd wafer level-chip scale package family

L. Zhang, R. Sitaraman, V. Patwardhan et al. · 2004 · 30 citations

Micro Smd, Engineering, Similar Package Configurations +19

A parametric solder joint reliability model for wafer level-chip scale package

James M. Pitarresi, S. Chaparala, Bahgat Sammakia et al. · 2003 · 11 citations

Reliability, Electrical Engineering, Reliability Engineering +15

Rows per page

1–2 of 2