Bahgat Sammakia

Buoyancy-Induced Flows and Transport

B. Gebhart, Yogesh Jaluria, Roop L. Mahajan et al. · Journal of Electronic Packaging · 1989 · 1.2K citations · Full text

Engineering, Hydrology, Fluid Dynamics +16

Thermal Challenges in Next-Generation Electronic Systems

Suresh V. Garimella, Amy S. Fleischer, Jayathi Y. Murthy et al. · IEEE Transactions on Components and Packaging Technologies · 2008 · 489 citations

Engineering, Electrical Engineering, Materials Science +17

Bending Fatigue Study of Sputtered ITO on Flexible Substrate

Khalid Alzoubi, Mohammad M. Hamasha, Susan Lu et al. · Journal of Display Technology · 2011 · 209 citations

Natural Sciences, Materials Engineering, Materials Science +17

A Brief Overview of Recent Developments in Thermal Management in Data Centers

Sami Alkharabsheh, John Fernandes, Betsegaw Gebrehiwot et al. · Journal of Electronic Packaging · 2015 · 106 citations

Engineering, Computer Science, Mechanical Engineering +17

Experimental evaluation of direct-to-chip cold plate liquid cooling for high-heat-density data centers

Ali Heydari, Ahmad R. Gharaibeh, Mohammad Tradat et al. · Applied Thermal Engineering · 2023 · 87 citations

Engineering, Computer Engineering, Mechanical Engineering +15