S. Chaparala

Mechanical shock testing and modeling of PC motherboards

James M. Pitarresi, Brian Roggeman, S. Chaparala et al. · 2004 · 58 citations

Engineering, Impact (Mechanics), Structural Crashworthiness +18

A parametric solder joint reliability model for wafer level-chip scale package

James M. Pitarresi, S. Chaparala, Bahgat Sammakia et al. · 2003 · 11 citations

Reliability, Electrical Engineering, Reliability Engineering +15

Experimental and Numerical Investigation of the Reliability of Double-Sided Area Array Assemblies

S. Chaparala, James M. Pitarresi, Satish Parupalli et al. · Journal of Electronic Packaging · 2006 · 10 citations

Engineering, Computer Architecture, Integrated Circuits +16

Effect of Dwell Times and Ramp Rates on the Thermal Cycling Reliability of Pb-Free Wafer-Level Chip Scale Packages: Experiments and Modeling

S. Chaparala, James M. Pitarresi, Michael Meilunas · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 2006 · 10 citations

Engineering, Dwell Times, Thermal Shock +20

Characterisation of Curing of Vinyl Ester Resin in an Industrial Pultrusion Process: Influence of Die Temperature

S. Chaparala, Omar Alajarmeh, Tristan Shelley et al. · Polymers · 2023 · 10 citations · Full text