Brian Roggeman

Mechanical shock testing and modeling of PC motherboards

James M. Pitarresi, Brian Roggeman, S. Chaparala et al. · 2004 · 58 citations

Engineering, Mechanical Engineering, Mechanical Behavior Of Materials +16

Effect of geometry and temperature cycle on the reliability of WLCSP solder joints

Satish C. Chaparala, Brian Roggeman, James M. Pitarresi et al. · IEEE Transactions on Components and Packaging Technologies · 2005 · 34 citations

Engineering, Materials Engineering, Materials Science +17

Assessment of PCB pad cratering resistance by joint level testing

Brian Roggeman, Peter Børgesen, Jing Li et al. · 2008 · 26 citations

Engineering, Materials Engineering, Materials Science +17

On the nature of pad cratering

Gaurav Godbole, Brian Roggeman, Peter Børgesen et al. · 2009 · 22 citations

Engineering, Materials Engineering, Materials Science +17

On the Assessment of the Life of SnAgCu Solder Joints in Cycling With Varying Amplitudes

Linlin Yang, Liang Yin, Babak Arafei et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 20 citations

Engineering, Materials Engineering, Materials Science +17