Hem Takiar

Warpage Prediction Methodology of Extremely Thin Package

Chen Peng, Zhongli Ji, Yangming Liu et al. · 2017 · 24 citations

Engineering, Mechanical Engineering, Systematic Methodology +19

MicroSMD-a wafer level chip scale package

N. Kelkar, Reenu Mathew, Hem Takiar et al. · IEEE Transactions on Advanced Packaging · 2000 · 23 citations

Electrical Engineering, Chip-scale Package, Engineering +13

Wafer level Chip Scale packaging : Solder joint reliability

Luu Nguyen, N. Kelkar, T. Kao et al. · 1998 · 18 citations

Study on Package Strength of uMCP (Multichip Package) for Mobile Application through Three-Point Bending Test and Simulation

Fa Xing, Yeow Chon Ong, Hong Wan Ng et al. · 2020 · 15 citations

Advanced Packaging, Multichip Package, Engineering +12

Challenges in Assembly and Reliability of Thin NAND Memory Die

Ning Ye, Qing Li, Huirong Zhang et al. · 2016 · 14 citations

Non-volatile Memory, Engineering, Mechanical Engineering +24