Concepedia

Yeow Chon Ong

YC

1

Publications

15

Citations

1

H-Index

2020

Active since

Affiliations

Micron (United States)(Current)

Yeow Chon Ong is an author at Micron (United States) specializing in electronic packaging, computer engineering, and engineering.

Top concepts

Publications per year

2020–2020

1

Publications

1

Study on Package Strength of uMCP (Multichip Package) for Mobile Application through Three-Point Bending Test and Simulation

Fa Xing, Yeow Chon Ong, Hong Wan Ng et al. · 2020 · 15 citations

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