T. Kao is an author at Xilinx (United States) specializing in microfabrication, computer engineering, and engineering.
Top concepts
EngineeringMicroelectronicsMicrofabricationComputer EngineeringElectronic PackagingComputer Architecture
Publications per year
1998–2009
2
2
Wafer level Chip Scale packaging : Solder joint reliability
Luu Nguyen, N. Kelkar, T. Kao et al. · 1998 · 18 citations
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