Concepedia

Bingshou Xiong

BX

2

Publications

126

Citations

2

H-Index

2006

Active since

Affiliations

Nanyang Technological University(Current)

Bingshou Xiong is an author at Nanyang Technological University specializing in electronic packaging, engineering, and computer architecture.

Top concepts

EngineeringElectronic PackagingCorrosionMicrostructureMaterial ScienceMicroelectronicsMicrofabricationComputer EngineeringComputer ArchitectureElectrical Engineering

Publications per year

2006–2009

2

Publications

2

Electromigration induced ductile-to-brittle transition in lead-free solder joints

Fei Ren, Jae-Woong Nah, K. N. Tu et al. · Applied Physics Letters · 2006 · 114 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +16

Warpage improvement for large die flip chip package

Bingshou Xiong, Minju Lee, T. Kao · 2009 · 12 citations

Physical Design (Electronics), Chip-scale Package, Engineering +12

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