Mechanism of electromigration-induced failure in the 97Pb–3Sn and 37Pb–63Sn composite solder joints

Jae-Woong Nah, Kyung W. Paik, Jong-ook Suh, +1

Journal of Applied Physics

EngineeringMechanical EngineeringElectromigration-induced FailureCu UbmInterconnect (Integrated Circuits) +14

Electromigration induced ductile-to-brittle transition in lead-free solder joints

Fei Ren, Jae-Woong Nah, K. N. Tu, +3

Applied Physics Letters

EngineeringSevere Plastic DeformationMechanical EngineeringAdvanced Packaging (Semiconductors)Corrosion +14

Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder interconnect

Jae-Woong Nah, Jong-ook Suh, K. N. Tu, +4

Journal of Applied Physics

Advanced PackagingMaterials ScienceElectrical EngineeringElectromigration TechniqueEngineering +12

A Novel Approach to Photonic Packaging Leveraging Existing High-Throughput Microelectronic Facilities

Tymon Barwicz, Yoichi Taira, Ted W. Lichoulas, +13

IEEE Journal of Selected Topics in Quantum Electronics

Optical MaterialsEngineeringDevice IntegrationIntegrated PhotonicsNovel Approach +19

Effect of current crowding and Joule heating on electromigration-induced failure in flip chip composite solder joints tested at room temperature

Jae-Woong Nah, Jong-ook Suh, K. N. Tu

Journal of Applied Physics

Materials ScienceRoom TemperatureElectrical EngineeringMetal ProcessingEngineering +13

Three-Dimensional a-Si:H Solar Cells on Glass Nanocone Arrays Patterned by Self-Assembled Sn Nanospheres

Jeehwan Kim, Augustin J. Hong, Jae-Woong Nah, +3

ACS Nano

Three-dimensional A-siEngineeringPhotovoltaic DevicesOptoelectronic DevicesGlass Nanocone Arrays +22

Electromigration in flip chip solder bump of 97Pb–3Sn/37Pb–63Sn combination structure

Jae-Woong Nah, Jong Hoon Kim, Hyuck Mo Lee, +1

Acta Materialia

Materials ScienceElectrical EngineeringElectromigration TechniqueEngineeringAdvanced Packaging (Semiconductors) +5

Automated, high-throughput photonic packaging

Tymon Barwicz, Ted W. Lichoulas, Yoichi Taira, +15

Optical Fiber Technology

Heterogeneous Integration Technology Demonstrations for Future Healthcare, IoT, and AI Computing Solutions

John Knickerbocker, R. Budd, B. Dang, +11

Artificial IntelligenceHealthcare Monitoring SystemsEngineeringDiagnosisWearable Technology +27

Electromigration in Pb-free flip chip solder joints on flexible substrates

Jae-Woong Nah, Fei Ren, K. N. Tu, +2

Journal of Applied Physics

EngineeringFlexible SubstratesSolder BumpInterconnect (Integrated Circuits)Flip Chip +14