Concepedia
Statistics
Publications
34
Citations
1.3K
H-Index
22
Active since
1999
Affiliations
IBM (United States)(Current)
IBM Research - Thomas J. Watson Research Center
University of California, Los Angeles
IBM Research - Tokyo
Korea Advanced Institute of Science and Technology
Jae-Woong Nah is an author at IBM (United States) specializing in engineering, materials engineering, and materials science.
Publications per year
1999–2019
Mechanism of electromigration-induced failure in the 97Pb–3Sn and 37Pb–63Sn composite solder joints
Jae-Woong Nah, Kyung W. Paik, Jong-ook Suh et al. · Journal of Applied Physics · 2003 · 140 citations
Natural Sciences, Materials Engineering, Materials Science +15
Electromigration induced ductile-to-brittle transition in lead-free solder joints
Fei Ren, Jae-Woong Nah, K. N. Tu et al. · Applied Physics Letters · 2006 · 115 citations
Natural Sciences, Electrical Engineering, Materials Science +17
Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder interconnect
Jae-Woong Nah, Jong-ook Suh, K. N. Tu et al. · Journal of Applied Physics · 2006 · 99 citations · Full text
Engineering, Electrical Engineering, Materials Engineering +17
A Novel Approach to Photonic Packaging Leveraging Existing High-Throughput Microelectronic Facilities
Tymon Barwicz, Yoichi Taira, Ted W. Lichoulas et al. · IEEE Journal of Selected Topics in Quantum Electronics · 2016 · 94 citations
Engineering, Electrical Engineering, Microfabrication +16
Effect of current crowding and Joule heating on electromigration-induced failure in flip chip composite solder joints tested at room temperature
Jae-Woong Nah, Jong-ook Suh, K. N. Tu · Journal of Applied Physics · 2005 · 88 citations
Engineering, Materials Engineering, Materials Science +14
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