Concepedia

Jae-Woong Nah

JN

33

Publications

1.3K

Citations

22

H-Index

1999

Active since

Affiliations

IBM (United States)(Current)

IBM Research - Thomas J. Watson Research Center

University of California, Los Angeles

IBM Research - Tokyo

Korea Advanced Institute of Science and Technology

Jae-Woong Nah is an author at IBM (United States) specializing in engineering, materials science, and electronic packaging.

Top concepts

Publications per year

1999–2019

33

Publications

33

Mechanism of electromigration-induced failure in the 97Pb–3Sn and 37Pb–63Sn composite solder joints

Jae-Woong Nah, Kyung W. Paik, Jong-ook Suh et al. · Journal of Applied Physics · 2003 · 140 citations

, , +16

Electromigration induced ductile-to-brittle transition in lead-free solder joints

Fei Ren, Jae-Woong Nah, K. N. Tu et al. · Applied Physics Letters · 2006 · 114 citations

, , +16

Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder interconnect

Jae-Woong Nah, Jong-ook Suh, K. N. Tu et al. · Journal of Applied Physics · 2006 · 99 citations · Full text

, , +14

A Novel Approach to Photonic Packaging Leveraging Existing High-Throughput Microelectronic Facilities

Tymon Barwicz, Yoichi Taira, Ted W. Lichoulas et al. · IEEE Journal of Selected Topics in Quantum Electronics · 2016 · 93 citations

, , +21

Effect of current crowding and Joule heating on electromigration-induced failure in flip chip composite solder joints tested at room temperature

Jae-Woong Nah, Jong-ook Suh, K. N. Tu · Journal of Applied Physics · 2005 · 87 citations

, , +15

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