Kyung W. Paik

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Publications

Citations

1.2K

H-Index

Active since

1988

Affiliations

Korea Advanced Institute of Science and Technology(Current)

Korea Atomic Energy Research Institute

University of California, Los Angeles

Georgia Institute of Technology

Argonne National Laboratory

Kyung W. Paik is an author at Korea Advanced Institute of Science and Technology specializing in materials engineering, materials science, and natural sciences.

Publications per year

1988–2011

Publications

Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications

Myung Jin Yim, Kyung W. Paik · International Journal of Adhesion and Adhesives · 2005 · 192 citations

Natural Sciences, Materials Engineering, Materials Science +17

Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging

Myung Jin Yim, Yi Li, Kyoung‐sik Moon et al. · Journal of Adhesion Science and Technology · 2008 · 177 citations

Engineering, Materials Engineering, Materials Science +17

Mechanism of electromigration-induced failure in the 97Pb–3Sn and 37Pb–63Sn composite solder joints

Jae-Woong Nah, Kyung W. Paik, Jong-ook Suh et al. · Journal of Applied Physics · 2003 · 140 citations

Natural Sciences, Materials Engineering, Materials Science +15

Characterization of U-2 wt% Mo and U-10 wt% Mo alloy powders prepared by centrifugal atomization

Ki Hwan Kim, Don Bac Lee, Chang Kyu Kim et al. · Journal of Nuclear Materials · 1997 · 81 citations

Natural Sciences, Materials Engineering, Materials Science +12

Anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) applications

Myung Jin Yim, Jin-Sang Hwang, Kyung W. Paik · International Journal of Adhesion and Adhesives · 2006 · 78 citations

Natural Sciences, Materials Engineering, Materials Science +13

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