Kyung W. Paik - Concepedia

Author

Kyung W. Paik

Korea Advanced Institute of Science and Technology

Also Known As

K. -W. Paik, K. W. Paik, K.W. Paik, Kyung W. Paik, Kyung Wook PAIK, Kyung Wook Paik, Kyung-Wook Paik

Publications

1.3K

Citations

H-Index

Concepts

All Affiliations

Korea Advanced Institute of Science and Technology Korea Atomic Energy Research Institute University of California, Los Angeles Georgia Institute of Technology Argonne National Laboratory

About

Kyung W. Paik is an author at Korea Advanced Institute of Science and Technology specializing in engineering, materials science, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	18	27	1.2K
2	Applied Physics	15	18	914
3	Electrical Engineering	8	8	630
4	Chemical Engineering	5	5	180
5	Chemistry	3	3	51

Kyung W. Paik

Publications

1.2K

Citations

H-Index

Page 1

	Year	Citations
Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications Myung Jin Yim, Kyung W. Paik International Journal of Adhesion and Adhesives Materials ScienceElectrical EngineeringSemiconductor Packaging ApplicationsEngineeringAdhesive Material	2005	192
Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging Myung Jin Yim, Yi Li, Kyoung‐sik Moon, Journal of Adhesion Science and Technology Flip Chip TechnologyEngineeringThin Film Process TechnologyAcf MaterialsAdvanced Packaging (Semiconductors)	2008	174
Mechanism of electromigration-induced failure in the 97Pb–3Sn and 37Pb–63Sn composite solder joints Jae-Woong Nah, Kyung W. Paik, Jong-ook Suh, Journal of Applied Physics EngineeringMechanical EngineeringElectromigration-induced FailureCu UbmInterconnect (Integrated Circuits)	2003	140
Characterization of U-2 wt% Mo and U-10 wt% Mo alloy powders prepared by centrifugal atomization Ki Hwan Kim, Don Bac Lee, Chang Kyu Kim, Journal of Nuclear Materials Materials EngineeringMaterials ScienceChemical EngineeringEngineeringPowder Metallurgy	1997	81
Anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) applications Myung Jin Yim, Jin-Sang Hwang, Kyung W. Paik International Journal of Adhesion and Adhesives Materials ScienceMaterials EngineeringAnisotropic Conductive FilmsEngineeringMaterial Analysis	2006	78
Experimental investigation of thermal characteristics for a microchannel heat sink subject to an impinging jet, using a micro-thermal sensor array Seok Pil Jang, Sung Jin Kim, Kyung W. Paik Sensors and Actuators A Physical Heat Transfer ProcessEngineeringExperimental InvestigationAerospace EngineeringMicrofabrication	2003	72
The multilayer-modified Stoney’s formula for laminated polymer composites on a silicon substrate Jin S. Kim, Kyung W. Paik, Seung Hwa Oh Journal of Applied Physics EngineeringMultiscale MechanicsMechanical EngineeringMultilayer ApplicationsLaminated Polymer Composites	1999	59
Adhesion enhancement of thin copper film on polyimide modified by oxygen reactive ion beam etching Kyung W. Paik, Arthur L. Ruoff Journal of Adhesion Science and Technology Materials ScienceMaterials EngineeringChemical EngineeringAdhesion EnhancementAdhesion Mechanism	1990	36
Comparison of electroplated eutectic Bi/Sn and Pb/Sn solder bumps on various UBM systems Se-Young Jang, Kyung W. Paik IEEE Transactions on Electronics Packaging Manufacturing Materials ScienceMaterials EngineeringElectrical EngineeringChemical EngineeringEngineering	2001	33
Review of Electrically Conductive Adhesive Technologies for Electronic Packaging Myung Jin Yim, Kyung W. Paik Electronic Materials Letters Materials ScienceElectrical EngineeringEngineeringAdhesive MaterialAdhesive Materials	2006	30

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