Jin-Sang Hwang

Publications

448

Citations

H-Index

2003

Active since

Affiliations

Korea Advanced Institute of Science and Technology(Current)

Korea Maritime Institute

Samsung (South Korea)

Sungkyunkwan University

Jin-Sang Hwang is an author at Korea Advanced Institute of Science and Technology specializing in engineering, electronic packaging, and applied physics.

Top concepts

EngineeringApplied PhysicsMaterial ScienceMicroelectronicsMicrofabricationElectronic PackagingElectrical EngineeringFlexible ElectronicsBusinessSystems Engineering

Publications per year

2003–2017

Publications

Anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) applications

Myung Jin Yim, Jin-Sang Hwang, Kyung W. Paik · International Journal of Adhesion and Adhesives · 2006 · 78 citations

Materials Science, Materials Engineering, Anisotropic Conductive Films +9

Protection of intellectual property based on a skeleton model in product design collaboration

Duhwan Mun, Jin-Sang Hwang, Soonhung Han · Computer-Aided Design · 2009 · 51 citations

Skeleton Model, Industrial Design, Ip Management +12

Optimal Methods of RTK-GPS/Accelerometer Integration to Monitor the Displacement of Structures

Jin-Sang Hwang, Hong‐Sik Yun, Sun-Kyu Park et al. · Sensors · 2012 · 50 citations · Full text

High reliable non-conductive adhesives for flip chip CSP applications

Myung‐Jin Kim, Jin-Sang Hwang, Woon‐Seong Kwon et al. · 2003 · 36 citations

Engineering, Mechanical Engineering, Flip Chip +18

Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications

Myung Jin Yim, In Ho Jeong, Hyung-Kyu Choi et al. · IEEE Transactions on Components and Packaging Technologies · 2005 · 35 citations

Engineering, Radio Frequency, Interconnect (Integrated Circuits) +16

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