Woon‐Seong Kwon

Statistics

Publications

Citations

546

H-Index

Active since

2002

Affiliations

Korea Advanced Institute of Science and Technology(Current)

Samsung (South Korea)

Xilinx (United States)

Institute of Microelectronics

Siliconware Precision Industries (Taiwan)

Woon‐Seong Kwon is an author at Korea Advanced Institute of Science and Technology specializing in engineering, electronic materials, and materials engineering.

Publications per year

2002–2014

Publications

Fundamental understanding of ACF conduction establishment with emphasis on the thermal and mechanical analysis

Woon‐Seong Kwon, Kyung‐Wook Paik · International Journal of Adhesion and Adhesives · 2003 · 63 citations

Engineering, Electrical Engineering, Materials Science +15

Fine pitch chip interconnection technology for 3D integration

Ji-Hwan Hwang, Jongyeon. Kim, Woon‐Seong Kwon et al. · 2010 · 52 citations

Engineering, Computer Engineering, Electronic Materials +16

Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

Woon‐Seong Kwon, Myung-Jin Yim, Kyung‐Wook Paik et al. · Journal of Electronic Packaging · 2005 · 50 citations

Natural Sciences, Materials Engineering, Materials Science +15

Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study

Woon‐Seong Kwon, Suk-Jin Ham, Kyung‐Wook Paik · Microelectronics Reliability · 2005 · 46 citations

Engineering, Materials Engineering, Materials Science +17

High reliable non-conductive adhesives for flip chip CSP applications

Myung‐Jin Kim, Jin-Sang Hwang, Woon‐Seong Kwon et al. · 2003 · 36 citations

Engineering, Materials Engineering, Materials Science +15

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