Concepedia

Myung-Jin Yim

MY

11

Publications

616

Citations

11

H-Index

1998

Active since

Affiliations

Korea Advanced Institute of Science and Technology(Current)

IBM Research - Thomas J. Watson Research Center

IBM (United States)

Georgia Institute of Technology

Myung-Jin Yim is an author at Korea Advanced Institute of Science and Technology specializing in engineering, electronic packaging, and applied physics.

Top concepts

Publications per year

1998–2009

11

Publications

11

Design and understanding of anisotropic conductive films (ACF's) for LCD packaging

Myung-Jin Yim, Kyung-Wook Paik · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1998 · 180 citations

, , +19

The contact resistance and reliability of anisotropically conductive film (ACF)

Myung-Jin Yim, Kyung-Wook Paik · IEEE Transactions on Advanced Packaging · 1999 · 123 citations

, , +14

Interfacial reaction studies on lead (Pb)-free solder alloys

S. K. Kang, Da‐Yuan Shih, Keith Fogel et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2002 · 81 citations

, , +15

Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

Woon‐Seong Kwon, Myung-Jin Yim, Kyung‐Wook Paik et al. · Journal of Electronic Packaging · 2005 · 50 citations

, , +22

Effect of nonconducting filler additions on ACA properties and the reliability of ACA flip-chip on organic substrates

Myung-Jin Yim, Kyung-Wook Paik · IEEE Transactions on Components and Packaging Technologies · 2001 · 44 citations

, , +21

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