Kyung-Wook Paik

Design and understanding of anisotropic conductive films (ACF's) for LCD packaging

Myung-Jin Yim, Kyung-Wook Paik · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1998 · 180 citations

Engineering, Mechanical Engineering, Display Technology +19

The contact resistance and reliability of anisotropically conductive film (ACF)

Myung-Jin Yim, Kyung-Wook Paik · IEEE Transactions on Advanced Packaging · 1999 · 123 citations

Materials Science, Materials Engineering, Engineering +14

The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface

Shaoan Wang, Xiangyu Chen, Keyu Luo et al. · Journal of Materials Research and Technology · 2023 · 96 citations · Full text

Friction Welding, Engineering, Mechanical Engineering +17

High performance encapsulant for light-emitting diodes (LEDs) by a sol–gel derived hydrogen siloxane hybrid

Joon-Soo Kim, Seung Cheol Yang, Seung‐Yeon Kwak et al. · Journal of Materials Chemistry · 2012 · 73 citations

Optical Materials, Engineering, Optoelectronic Devices +21

Effect of nonconducting filler additions on ACA properties and the reliability of ACA flip-chip on organic substrates

Myung-Jin Yim, Kyung-Wook Paik · IEEE Transactions on Components and Packaging Technologies · 2001 · 44 citations

Engineering, Thermoplastic Composite, Chemical Engineering +21