Suk-Jin Ham

Application of Au-Sn eutectic bonding in hermetic radio-frequency microelectromechanical system wafer level packaging

Qian Wang, Sung‐Hoon Choa, Woonbae Kim et al. · Journal of Electronic Materials · 2006 · 69 citations

Materials Science, Materials Engineering, Electrical Engineering +12

Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

Woon‐Seong Kwon, Myung-Jin Yim, Kyung‐Wook Paik et al. · Journal of Electronic Packaging · 2005 · 50 citations

Engineering, Mechanical Engineering, Organic Substrates +22

Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study

Woon‐Seong Kwon, Suk-Jin Ham, Kyung‐Wook Paik · Microelectronics Reliability · 2005 · 46 citations

Electrical Engineering, Chip-scale Package, Engineering +12

Wafer-level low temperature bonding with Au-In system

Yoonchul Sohn, Qian Wang, Suk-Jin Ham et al. · 2007 · 23 citations

Materials Science, Materials Engineering, Advanced Packaging +15

A low temperature, hermetic wafer level packaging method for RF MEMS switch

Woonbae Kim, Qian Wang, Jun-Sik Hwang et al. · 2005 · 21 citations

Engineering, Micro-electromechanical System, Low Temperature +17