Myung Jin Yim - Concepedia

Author

Myung Jin Yim

Korea Advanced Institute of Science and Technology

Also Known As

M. J. Yim, M. Yim, M.-J. Yim, M.J. Yim, Myung J. Yim, Myung Jin Yim

Publications

1.1K

Citations

H-Index

Concepts

All Affiliations

Korea Advanced Institute of Science and Technology Georgia Institute of Technology Intel (United States)

About

Myung Jin Yim is an author at Korea Advanced Institute of Science and Technology specializing in engineering, materials science, and electronic packaging.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	17	25	979
2	Applied Physics	14	17	722
3	Electrical Engineering	11	11	603
4	Chemical Engineering	1	1	51
5	Chemistry	1	1	12

Myung Jin Yim

Publications

989

Citations

H-Index

Page 1

	Year	Citations
Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications Myung Jin Yim, Kyung W. Paik International Journal of Adhesion and Adhesives Materials ScienceElectrical EngineeringSemiconductor Packaging ApplicationsEngineeringAdhesive Material	2005	192
Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging Myung Jin Yim, Yi Li, Kyoung‐sik Moon, Journal of Adhesion Science and Technology Flip Chip TechnologyEngineeringThin Film Process TechnologyAcf MaterialsAdvanced Packaging (Semiconductors)	2008	174
Studies of the mechanical and electrical properties of lead-free solder joints S. K. Kang, Wooseok Choi, Myung Jin Yim, Journal of Electronic Materials Materials ScienceFriction WeldingEngineeringCorrosionMechanical Engineering	2002	84
Anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) applications Myung Jin Yim, Jin-Sang Hwang, Kyung W. Paik International Journal of Adhesion and Adhesives Materials ScienceMaterials EngineeringAnisotropic Conductive FilmsEngineeringMaterial Analysis	2006	78
Oxidation Prevention and Electrical Property Enhancement of Copper-Filled Isotropically Conductive Adhesives Myung Jin Yim, Yi Li, Kyoung‐Sik Moon, Journal of Electronic Materials EngineeringSurface NanotechnologyInterconnect (Integrated Circuits)Chemical EngineeringNanoengineering	2007	51
Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications Myung Jin Yim, In Ho Jeong, Hyung-Kyu Choi, IEEE Transactions on Components and Packaging Technologies EngineeringRadio FrequencyInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)Several Flip Chip	2005	35
Reduced thermal strain in flip chip assembly on organic substrate using low CTE anisotropic conductive film Myung Jin Yim, Young-Doo Jeon, Kyung‐Wook Paik IEEE Transactions on Electronics Packaging Manufacturing EngineeringOrganic ElectronicsMechanical EngineeringFlip ChipAcf Materials	2000	34
Highly reliable flip-chip-on-flex package using multilayered anisotropic conductive film Myung Jin Yim, Jin-Sang Hwang, Jin Gu Kim, Journal of Electronic Materials Materials ScienceChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Flexible Electronics	2004	31
Review of Electrically Conductive Adhesive Technologies for Electronic Packaging Myung Jin Yim, Kyung W. Paik Electronic Materials Letters Materials ScienceElectrical EngineeringEngineeringAdhesive MaterialAdhesive Materials	2006	30
Void Formation Study of Flip Chip in Package Using No-Flow Underfill Sang-Il Lee, Myung Jin Yim, R.N. Master, IEEE Transactions on Electronics Packaging Manufacturing EngineeringMechanical EngineeringInterconnect (Integrated Circuits)Flip ChipAdvanced Packaging (Semiconductors)	2008	29

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