Myung Jin Yim

Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications

Myung Jin Yim, Kyung W. Paik · International Journal of Adhesion and Adhesives · 2005 · 192 citations

Materials Science, Electrical Engineering, Semiconductor Packaging Applications +10

Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging

Myung Jin Yim, Yi Li, Kyoung‐sik Moon et al. · Journal of Adhesion Science and Technology · 2008 · 174 citations

Flip Chip Technology, Engineering, Thin Film Process Technology +19

Studies of the mechanical and electrical properties of lead-free solder joints

S. K. Kang, Wooseok Choi, Myung Jin Yim et al. · Journal of Electronic Materials · 2002 · 84 citations

Materials Science, Friction Welding, Engineering +4

Anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) applications

Myung Jin Yim, Jin-Sang Hwang, Kyung W. Paik · International Journal of Adhesion and Adhesives · 2006 · 78 citations

Materials Science, Materials Engineering, Anisotropic Conductive Films +9

Oxidation Prevention and Electrical Property Enhancement of Copper-Filled Isotropically Conductive Adhesives

Myung Jin Yim, Yi Li, Kyoung‐Sik Moon et al. · Journal of Electronic Materials · 2007 · 51 citations · Full text

Engineering, Surface Nanotechnology, Interconnect (Integrated Circuits) +21